CRCW04021K00JNTD Vishay, CRCW04021K00JNTD Datasheet - Page 6
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CRCW04021K00JNTD
Manufacturer Part Number
CRCW04021K00JNTD
Description
Res Thick Film 0402 1K Ohm 5% 1/16W ±200ppm/°C Molded SMD Paper T/R
Manufacturer
Vishay
Type
Thick Filmr
Series
CRCWr
Datasheet
1.CRCW0603100KJNEA.pdf
(8 pages)
Specifications of CRCW04021K00JNTD
Case Size
0402
Resistance Value
1 KOhm
Power Rating
1/16 W
Tolerance
5 %
Resistance (ohms)
1K
Power (watts)
0.063W, 1/16W
Composition
Thick Film
Temperature Coefficient
±200ppm/°C
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Height
0.014" (0.35mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0402 (1005 Metric)
Resistance In Ohms
1.00K
Case
0402 (1005 metric)
Resistance
1kohm
Resistance Tolerance
± 5%
Voltage Rating
50V
Resistor Element Material
Thick Film
Resistor Case Style
0402
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
CRCW0402 200 1K 5% RT7
CRCW0402102JRT7
CRCW0402102JRT7
Document Number: 20008
Revision: 18-Nov-10
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
METHOD
78 (Cab)
60082-2
21 (Uu
21 (Uu
45 (XA)
45 (XA)
58 (Td)
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
-
-
-
3)
1)
Component solvent resistance
Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
Solvent resistance of marking
Rapid change of temperature
Flamability, needle flame test
Resistance to soldering heat
Damp heat, steady state
Temperature coefficient
Electrostatic discharge
category temperature
(human body model)
Endurance at upper
Short time overload
Endurance at 70 °C
Substrate bending
Climatic sequence:
Shear (adhesion)
Damp heat, cyclic
Damp heat, cyclic
Low air pressure
Voltage proof
Solderability
Resistance
DC load
Dry heat
TEST
Cold
For technical questions, contact:
Stability for product types:
Solder bath method; Sn60Pb40;
U = 2.5 x
ESD test voltage acc. to size
50 °C; method 1, toothbrush
3 pos. + 3 neg. discharges;
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
(235 ± 5) °C, (2 ± 0.2) s
1 kPa; (25 ± 10) °C; 1 h
(93 ± 3) % RH; 56 days
(260 ± 5) °C; (10 ± 1) s
U = √(P
duration: Acc. to style
Depth 2 mm; 3 times
Solder bath method
(20/- 55/20) °C and
55 °C; ≥ 90 % RH;
55 °C; ≥ 90 % RH;
U = 1.4 · U
non-activated flux;
30 min. at - 55 °C;
1.5 h on; 0.5 h off;
Isopropyl alcohol;
Isopropyl alcohol;
30 min. at 125°C
IEC 60695-11-5;
50 °C; method 2
155 °C; 1000 h
IEC 61340-3-1;
(20/125/20) °C
PROCEDURE
U =
24 h; 5 cycles
70 °C; 1000 h
70 °C; 8000 h
24 h; 1 cycle
125 °C; 16 h
1000 cycles
- 55 °C; 2 h
(40 ± 2) °C;
P
5 cycles
70
70
10 s
P
x R) ≤ U
-
-
x R
thickfilmchip@vishay.com
70
ins;
x R
≤ 2 x U
60 s
D/CRCW
max.
max.
;
STABILITY CLASS 1
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
Good tinning (≥ 95 %
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
no visible damage
± (2 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 100 ppm/K
REQUIREMENTS PERMISSIBLE
covered);
± 1 %
no open circuit in bent position
No flashover or breakdown
± (0.25 % R + 0.05 Ω)
No burning after 30 s
No visible damage,
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
No visible damage
No visible damage
no visible damage
Marking legible,
CHANGE (ΔR)
STABILITY CLASS 2
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
1 Ω to 10 MΩ
OR BETTER
± 200 ppm/K
D/CRCW
www.vishay.com
± 5 %
Vishay
123