MAX2644EXT+T Maxim Integrated Products, MAX2644EXT+T Datasheet - Page 6

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MAX2644EXT+T

Manufacturer Part Number
MAX2644EXT+T
Description
RF Amp Chip Single GP 2.5GHz 5.5V 6-Pin SC-70 T/R
Manufacturer
Maxim Integrated Products
Type
General Purpose Amplifierr
Datasheet

Specifications of MAX2644EXT+T

Package
6SC-70
Number Of Channels Per Chip
1
Typical Power Gain
17@2450MHz dB
Maximum Operating Frequency Range
2000 to 3000 MHz
Maximum Output Return Loss
10(Typ)@2450MHz dB
Typical Noise Figure
2@2450MHz dB
Standby mode is achieved by disconnecting BIAS as
shown in Figure 1. Avoid capacitance at the BIAS pin
by connecting the bias resistor from BIAS to the switch.
A properly designed PC board is essential to any
RF/microwave circuit. Use controlled impedance lines
on all high-frequency inputs and outputs. Bypass with
decoupling capacitors located close to the device V
2.4GHz SiGe,
High IP3 Low-Noise Amplifier
Table 1. MAX2644 Typical Scattering Parameters
(R
Table 2. MAX2644 Typical Scattering Parameters
(R
6
FREQ.
FREQ.
BIAS
BIAS
(MHz)
(MHz)
2200
2250
2300
2350
2400
2450
2500
2550
2600
2650
2700
_______________________________________________________________________________________
2200
2250
2300
2350
2400
2450
2500
2550
2600
2650
2700
= 750Ω, V
= 1.2kΩ, V
0.3482
0.3121
0.3051
0.3693
0.4769
0.5619
0.5948
0.5939
0.5825
0.5708
0.5604
0.3372
0.3098
0.3283
0.4005
0.4839
0.5443
0.5758
0.5784
0.5698
0.5600
0.5533
MAG
MAG
S11
S11
CC
CC
S11 PHASE
(DEGREES)
S11 PHASE
(DEGREES)
= +3.0V, T
= +3.0V, T
-67.06
-58.60
-43.64
-30.34
-29.48
-35.54
-42.64
-47.58
-50.94
-53.14
-54.35
-79.36
-70.09
-57.20
-50.46
-50.28
-56.33
-60.09
-63.61
-66.56
-68.51
-69.86
Layout Issues
A
A
5.2390
5.3790
5.5982
5.8137
5.8063
5.6624
5.3015
4.7813
4.3271
4.1961
4.1068
5.1940
5.3156
5.4281
5.4175
5.3346
5.0687
4.9556
4.5952
4.2364
4.1376
4.0729
MAG
MAG
S21
S21
= +25°C.)
= +25°C.)
Standby
S21 PHASE
(DEGREES)
S21 PHASE
(DEGREES)
CC
-177.33
178.72
173.43
166.48
158.29
150.06
142.37
136.67
134.58
133.48
128.01
170.97
166.79
159.22
150.70
143.93
136.45
132.16
127.68
126.58
126.51
120.60
pin. For long V
additional decoupling capacitors. These additional
capacitors can be located farther away from the device
package. Proper grounding of the GND pins is essen-
tial. If the PC board uses a topside RF ground, connect
it directly to all GND pins. For a board where the
ground plane is not on the component layer, the best
technique is to connect the GND pins to the board with
a plated through-hole located close to the package.
0.0402
0.0435
0.0452
0.0427
0.0341
0.0236
0.0117
0.0034
0.0056
0.0096
0.0125
0.0414
0.0445
0.0469
0.0441
0.0349
0.0233
0.0113
0.0041
0.0063
0.0103
0.0133
MAG
MAG
S12
S12
CC
S12 PHASE
(DEGREES)
S12 PHASE
(DEGREES)
-104.09
-124.80
-134.75
-110.49
-128.93
-140.21
161.53
151.97
136.90
116.57
157.19
146.70
130.62
108.72
-13.74
-38.98
95.13
68.36
41.34
85.67
58.80
27.74
lines, it may be necessary to add
0.2873
0.2305
0.1735
0.1582
0.2687
0.4043
0.5030
0.5602
0.5952
0.6215
0.6434
0.2818
0.2204
0.1566
0.1480
0.2795
0.4179
0.5135
0.5622
0.5986
0.6208
0.6425
MAG
MAG
S22
S22
S22 PHASE
(DEGREES)
(DEGREES)
S22 PHASE
-76.58
-69.42
-54.22
-16.42
-12.76
-15.97
-18.83
-73.71
-67.13
-50.26
-10.43
-12.93
15.12
11.12
-2.19
-8.04
-3.96
-2.66
-7.45
6.52
5.00
3.28

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