MAX9994ETP+ Maxim Integrated Products, MAX9994ETP+ Datasheet - Page 11

• Manufacturer Part Number: MAX9994ETP+
• Description: Up-Down Converters IC MIXER DOWN CONV 1700MHz to 2200MHz
• Manufacturer: Maxim Integrated Products

Specifications of MAX9994ETP+

• Maximum Input Frequency: 2200 MHz
• Maximum Power Dissipation: 1800 mW
• Mounting Style: SMD/SMT
• Maximum Operating Frequency: 350 MHz
• Maximum Power Gain: 9.2 dB
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: TQFN-20 EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The MAX9994 high-linearity downconversion mixer pro-
vides 8.3dB of conversion gain and 26.2dBm of IIP3,
with a typical 9.7dB noise figure. The integrated baluns
and matching circuitry allow for 50Ω single-ended inter-
faces to the RF and the two LO ports. A single-pole,
double-throw (SPDT) switch provides 50ns switching
time between the two LO inputs with 45dB of LO-to-LO
isolation. Furthermore, the integrated LO buffer pro-
vides a high drive level to the mixer core, reducing the
LO drive required at the MAX9994’s inputs to a range
of -3dBm to +3dBm. The IF port incorporates a differ-
ential output, which is ideal for providing enhanced IIP2
performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in WCDMA, TD-SCDMA, LTE,
TD-LTE, cdma2000, and 2G/2.5G/3G DCS1800 and
PCS1900 base stations. The MAX9994 is specified to
operate over a 1400MHz to 2200MHz RF frequency
range, a 1400MHz to 2000MHz LO frequency range,
and a 40MHz to 350MHz IF frequency range. Operation
beyond these ranges is possible; see the Typical
Operating Characteristics for additional details.
4, 5, 10, 12,
1, 6, 8, 14
13, 17
18, 19
PIN
11
15
16
20
—
2
3
7
9
Downconversion Mixer with LO Buffer/Switch
SiGe High-Linearity, 1400MHz to 2200MHz
LOBIAS
LOSEL
IF-, IF+
IFBIAS
NAME
LEXT
GND
V
LO1
LO2
TAP
RF
EP
CC
______________________________________________________________________________________
Detailed Description
Power-Supply Connection. Bypass each V
Application Circuit.
Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
Ground
Bias Resistor for Internal LO Buffer. Connect a 549Ω ±1% resistor from LOBIAS to the power supply.
Local Oscillator Select. Logic control input for selecting LO1 or LO2.
Local Oscillator Input 1. Drive LOSEL low to select LO1.
Local Oscillator Input 2. Drive LOSEL high to select LO2.
External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor
carries approximately 100mA DC current.
Differential IF Outputs. Each output requires external bias to V
Application Circuit).
IF Bias Resistor Connection for IF Amplifier. Connect an 806Ω resistor from IFBIAS to GND.
Exposed Pad. Solder the exposed pad to the ground plane using multiple vias.
With a wide LO range of 1400MHz to 2000MHz, the
MAX9994 can be used in either high-side or low-side
LO injection architectures, depending on the RF band
of interest. Higher LO applications are supported by
the MAX9996, which is pin-pin and functionally compat-
ible with the MAX9994.
The MAX9994 RF input is internally matched to 50Ω,
requiring no external matching components. A DC-
blocking capacitor is required because the input is
internally DC shorted to ground through the on-chip
balun. Input return loss is typically 21dB over the entire
1700MHz to 2200MHz RF frequency range.
The MAX9994 can be used for either high-side or low-
side injection applications with a 1400MHz to 2000MHz
LO frequency range. For a device with a 1900MHz to
2400MHz LO frequency range, refer to the MAX9996
data sheet. As an added feature, the MAX9994 includes
an internal LO SPDT switch that can be used for fre-
quency-hopping applications. The switch selects one of
the two single-ended LO ports, allowing the external
oscillator to settle on a particular frequency before it is
CC
pin to GND with capacitors as shown in the Typical
FUNCTION
CC
LO Inputs, Buffer, and Balun
through an RF choke (see the Typical
Pin Description
RF Input and Balun
11