MJD3055G ON Semiconductor, MJD3055G Datasheet
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MJD3055G
Specifications of MJD3055G
MJD3055GOS
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MJD3055G Summary of contents
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MJD2955 (PNP) MJD3055 (NPN) Complementary Power Transistors DPAK For Surface Mount Applications Designed for general purpose amplifier and low speed switching applications. Features • Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix) • Straight Lead Version in ...
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... Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. ORDERING INFORMATION Device MJD2955G MJD2955−1G MJD2955T4G MJD3055G MJD3055T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/ 25_C unless otherwise noted) ...
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500 300 200 T = 150°C J 100 25°C - 55° 0.01 0.02 0.05 0.1 0.2 0.5 I ...
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T = 25°C J 1.6 1 BE(sat 0 0 CE(sat 0.1 0.2 0.3 0.5 ...
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... DETAIL 0.005 (0.13 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE GAUGE L2 SEATING C PLANE PLANE DETAIL A ROTATED SOLDERING FOOTPRINT* 6.20 3.0 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...