MAX2247EBC-T Maxim Integrated Products, MAX2247EBC-T Datasheet - Page 9

• Manufacturer Part Number: MAX2247EBC-T
• Description: RF Amplifier 2.4GHz SiGe Linear P ower Amplifier for 8
• Manufacturer: Maxim Integrated Products
• Type: Power Amplifierr

Specifications of MAX2247EBC-T

• Operating Frequency: 2500 MHz
• Supply Current: 345 mA
• Maximum Power Dissipation: 1300 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: UCSP
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 1 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

To achieve optimum gain, output power, thermal perfor-
mance, and ACPR performance, ground vias should be
properly placed throughout the layout. Each ground pin
requires its own through-hole via (diameter = 10mils)
placed as near as possible to the device pin. This
reduces ground inductance, thermal resistance, and
feedback between stages. Use the MAX2247 EV kit PC
board layout as a guide.
The tiny chip-scale package (UCSP) represents a
unique package that greatly reduces board space
compared to other packages. UCSP reliability is inte-
grally linked to the user’s assembly methods, circuit
board material, and usage environment. Operating life
test and moisture resistance remains uncompromised,
as it is primarily determined by the wafer-fabrication
process. Mechanical stress performance is a greater
consideration for a UCSP. UCSP solder-joint contact
_______________________________________________________________________________________
2.4GHz SiGe Linear Power Amplifier
UCSP Reliability
Ground Vias
For the latest package outline information, go to
www.maxim-ic.com/packages.
integrity must be considered because the package is
attached through direct solder contact to the user’s PC
board. Testing done to characterize the UCSP reliability
performance shows that it is capable of performing reli-
ably through environmental stresses. Users should also
be aware that as with any interconnect system there
are electromigration-based current limits that, in this
case, apply to the maximum allowable current in the
bumps. Reliability is a function of this current, the duty
cycle, lifetime, and bump temperature. See the
Absolute Maximum Ratings section for any specific lim-
itations listed under Continuous Operating Lifetime.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website at www.maxim-ic.com/1st_pages/UCSP.htm.
TRANSISTOR COUNT: 1425
PACKAGE TYPE
4 x 3 UCSP
12 WLP
PACKAGE CODE
Package Information
W121B2+2
B12-8
Chip Information
DOCUMENT NO.
21-0104
21-0009
9