MAX2242EBC+T Maxim Integrated Products, MAX2242EBC+T Datasheet - Page 7

• Manufacturer Part Number: MAX2242EBC+T
• Description: RF Amplifier 2.4GHz to 2.5GHz Lin ear Power Amplifier
• Manufacturer: Maxim Integrated Products
• Type: Power Amplifierr

Specifications of MAX2242EBC+T

• Operating Frequency: 2500 MHz
• Supply Current: 300 mA
• Maximum Power Dissipation: 1600 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: UCSP
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 1 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

For a DAC capable of both sourcing and sinking cur-
rents, the full voltage range of the DAC (typically from 0
to +3V) can be used. By substituting the desired values
of V
can be easily calculated.
For a DAC capable of sourcing current only, use equa-
tion 4 to determine the value of resistor R2 for the
desired maximum current. Use equation 1 to determine
the value of resistor R1 for the desired minimum current.
For a DAC capable of sinking current only, set resistors
R1 and R2 to 0 and connect the DAC directly to the
BIAS pin. Use equation 5 to determine the DAC current
required for a given I
Apply logic low to SHDN (pin C2) to place the
MAX2242 into shutdown mode. In this mode, all gain
stages are disabled and supply current typically drops
to 0.5µA. Note that the shutdown current is lowest when
V
The power detector generates a voltage proportional to
the output power by monitoring the output power using
an internal coupler. It is fully temperature compensated
and allows the user to set the bandwidth with an exter-
nal capacitor. For maximum bandwidth, connect a
47kΩ resistor from PD_OUT to GND and do not use any
external capacitor.
V
stage amplifiers, and are also part of the interstage
matching networks required to optimize performance
between the three amplifier stages. See the Typical
Application Circuit for the lumped and discrete compo-
nent values used on the MAX2242 EV kit for optimum
interstage matching and RF bypassing. In addition to
RF bypass capacitors on each bias line, a global
bypass capacitor of 22µF is necessary to filter any
noise on the supply line. Route separate V
paths from the global bypass capacitor (star topology)
to avoid coupling between PA stages. Use the
MAX2242 EV kit PC board layout as a guide.
The RFIN port requires a matching network. The RFIN
port impedance is 16–j30 at 2.45GHz. See the Typical
Application Circuit for recommended component values.
CC1
SHDN
MAX
and V
= 0.
and I
Interstage Matching and Bypassing
CC2
MAX
Applications Information
provide bias to the first and second
_______________________________________________________________________________________
into equations 1 and 2, R1 and R2
CC
.
External Matching
Shutdown Mode
Power Detector
CC
bias
Linear Power Amplifier
The RFOUT port is an open-collector output that must
be pulled to V
biasing. A shunt 33pF capacitor to ground is required
at the supply side of the inductor. In addition, a match-
ing network is required for optimum gain, efficiency,
ACPR, and output power. The load impedance seen at
the RFOUT port of the MAX2242 on the EV kit is
approximately 8 + j5Ω. This should serve as a good
starting point for your layout. However, optimum perfor-
mance is layout dependent and some component opti-
mization may be required. See the Typical Application
Circuit for the lumped and discrete component values
used on the MAX2242 EV kit to achieve this impedance.
Placement and type of ground vias are important to
achieve optimum gain and output power and ACPR
performance. Each ground pin requires its own through-
hole via (via diameter = 10mils) placed as near to the
device pin as possible to reduce ground inductance
and feedback between stages. Use the MAX2242 EV
kit PC board layout as a guide.
The MAX2242 EV kit serves as a layout guide. Use con-
trolled-impedance lines on all high-frequency inputs
and outputs. The GND pins also serve as heat sinks.
Connect all GND pins directly to the topside RF ground.
On boards where the ground plane is not on the com-
ponent side, connect all GND pins to the ground plane
with plated multiple throughholes close to the package.
PC board traces connecting the GND pins also serve
as heat sinks. Make sure that the traces are sufficiently
wide.
UCSP represents a unique packaging form factor that
may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit-board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP. Performance through the
operating-life test and moisture resistance remains
uncompromised as it is primarily determined by the
wafer-fabrication process. Mechanical stress perfor-
mance is a greater consideration for a UCSP. UCSPs
are attached through direct solder contact to the user’s
PC board, foregoing the inherent stress relief of a pack-
aged-product lead frame. Solder joint contact integrity
must be considered. Testing done to characterize the
Layout and Thermal Management Issues
2.4GHz to 2.5GHz
CC
through a 10nH RF choke for proper
UCSP Reliability
Ground Vias
7