MAX2611EUS+T Maxim Integrated Products, MAX2611EUS+T Datasheet - Page 5

• Manufacturer Part Number: MAX2611EUS+T
• Description: RF Amplifier DC-to-Microwave, Gen eral Purpose Amplifi
• Manufacturer: Maxim Integrated Products
• Type: General Purpose Amplifierr

Specifications of MAX2611EUS+T

• Operating Frequency: 0 Hz to 1100 MHz
• P1db: 2.9 dBm
• Noise Figure: 3.5 dB at 500 MHz
• Bandwidth: 1100 MHz
• Supply Current: 16 mA
• Maximum Power Dissipation: 320 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 1 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The MAX2611 is a broadband amplifier with flat gain
and 50Ω input and output ports. Its small size and sim-
ple bias circuitry make it ideal for applications where
board space is limited.
As shown in the Typical Operating Circuit, the
MAX2611 is easy to use. Input and output series
capacitors may be necessary to block DC bias volt-
ages (generated by the MAX2611) from interacting with
adjacent circuitry. These capacitors must be large
enough to contribute negligible reactance in a 50Ω
system at the minimum operating frequency. Use the
following equation to calculate their minimum value:
where f (in MHz) is the minimum operating frequency.
Bias current is supplied to the MAX2611 through an
external resistor and optional RF choke connected
between V
from V
line from other circuitry. The resistor value determines
the bias current from the following equation:
where V
An optional RF choke can be added to improve the
MAX2611’s gain and output power. The choke should
be large enough to reduce the loading effect that the
bias resistor has on the amplifier output. This is a func-
tion of R
impedance.
_______________Detailed Description
__________Applications Information
CC
D
BIAS
to GND may be necessary to isolate the V
is the device voltage, nominally 3.8V.
CC
, frequency of operation, and output
C
and the OUT pin. A bypass capacitor
BLOCK
_______________________________________________________________________________________
I
D
DC-to-Microwave, Low-Noise Amplifier
=
=
V
CC
53,000
R
External Components
BIAS
f
- V
D
(pF)
CC
Proper grounding of the GND pins is essential. If the
PC board uses a topside RF ground, the GND pins
should be connected directly to it. For a board where
the ground plane is not on the component side, the
best technique is to connect the GND pins to it through
multiple plated through-holes.
An example PC board layout is given in Figure 1. It
uses FR-4 with 31mil layer thickness between the RF
lines and the ground plane. This board satisfies all the
above requirements.
Figure 1. Example PC Board Layout
EXPANDED VIEW
PC Board Layout Example
Grounding
5