MAX2029ETP-T Maxim Integrated Products, MAX2029ETP-T Datasheet - Page 2

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MAX2029ETP-T

Manufacturer Part Number
MAX2029ETP-T
Description
Up-Down Converters SiGe High-Linearity, 815MHz to 1000MHz U
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX2029ETP-T

Maximum Input Frequency
1000 MHz
Maximum Operating Frequency
250 MHz
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Package / Case
TQFN-20 EP
High-Linearity, 815MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V
RF (RF is DC shorted to GND through a balun)..................50mA
LO1, LO2 to GND ..................................................-0.3V to +0.3V
IF+, IF- to GND ...........................................-0.3V to (V
TAP to GND ...........................................................-0.3V to +1.4V
LOSEL to GND ...........................................-0.3V to (V
LOBIAS to GND..........................................-0.3V to (V
RF, LO1, LO2 Input Power* ............................................+20dBm
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
an IF balun. Typical values are at V
AC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , C5 = 3.3pF, L1 and C4 not used, V
P
+85°C, unless otherwise noted. Typical values are at V
T
Note A: Based on junction temperature T
Note B: Junction temperature T
Note C: T
*Maximum reliable continuous input power applied to the RF, LO, and IF ports of this device is +15dBm from a 50Ω source.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
LOSEL Input Logic-Low
LOSEL Input Logic-High
Input Current
RF Frequency Range
LO Frequency Range
IF Frequency Range
LO Drive
LO1-to-LO2 Isolation (Note 3)
Maximum LO Leakage at RF Port
Maximum LO Leakage at IF Port
C
CC
LO
= +25°C, unless otherwise noted.) (Note 1)
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
= -3dBm to +3dBm, P
exposed paddle is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150°C.
PCB is known. The junction temperature must not exceed +150°C. See the Applications Information section for details.
C
is the temperature on the exposed paddle of the package. T
PARAMETER
PARAMETER
RF
CC
= 0dBm, f
J
= +4.75V to +5.25V, no RF signals applied, T
= T
CC
A
= +5V, T
+ (θ
SYMBOL
SYMBOL
RF
J
I
IH
V
JA
P
= T
I
V
f
V
= 815MHz to 1000MHz, f
f
f
CC
RF
LO
CC
LO
, I
IF
IH
IL
x V
C
IL
C
= +25°C, unless otherwise noted.)
+ (θ
CC
P
(Note 2)
(Note 2)
External IF transformer dependence (Note 2)
(Note 2)
LO2 selected, P
f
870MHz
LO1 selected, P
f
870MHz
P
f
RF
RF
LO
x I
JC
CC
CC
CC
LO
LO
CC
= 920MHz to 960MHz, f
= 920MHz to 960MHz, f
= 830MHz to 870MHz (Note 3)
x V
+ 0.3V)
+ 0.3V)
+ 0.3V)
= +3dBm
= +3dBm, f
). This formula can be used when the ambient temperature of the EV kit
CC
CC
x I
CC
= +5V, P
CC
= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources,
CONDITIONS
CONDITIONS
). This formula can be used when the temperature of the
RF
LO
LO
LO
Continuous Power Dissipation (T
θ
θ
Operating Temperature Range (Note C) ....T
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
= 920MHz to 960MHz,
JA
JC
= +3dBm, T
= +3dBm, T
20-Pin Thin QFN-EP................................................................5W
= 570MHz to 900MHz, f
A
LO
(Note B)....................................................................+38°C/W
.................................................................................+13°C/W
is the ambient temperature of the device and PCB.
= 0dBm, f
C
= -40°C to +85°C. IF+ and IF- are DC grounded through
LO
LO
= 830MHz to
= 830MHz to
C
C
= +25°C,
= +25°C,
RF
= 920MHz, f
IF
= 90MHz, f
4.75
MIN
MIN
815
570
DC
48
50
-3
2
C
LO
= +85°C) (Note A)
= 830MHz, f
±0.01
-29.5
TYP
5.00
TYP
-17
85
53
56
LO
< f
C
= -40°C to +85°C
RF
MAX
MAX
1000
5.25
100
900
250
-23
0.8
+3
, T
IF
C
= -40°C to
= 90MHz,
UNITS
UNITS
MHz
MHz
MHz
dBm
dBm
dBm
mA
dB
µA
V
V
V

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