2DAC-C16RLF Bourns Inc., 2DAC-C16RLF Datasheet
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2DAC-C16RLF
Specifications of 2DAC-C16RLF
Related parts for 2DAC-C16RLF
2DAC-C16RLF Summary of contents
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... Customers should verify actual device performance in their specific applications. Features Lead free versions available RoHS compliant (lead free version)* New Product Development Integrated Passive Device ESD Protection to IEC61000-4-2 Spec. 2DAC-C16R Series - Integrated Passive & Active Device using CSP SOLDER BUMPS Symbol Minimum V 6 ...
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... Daisy-Chain test device. A 25-Pin Daisy Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This array featuring 0.5 mm pitch solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2DAC-C16R and is thus deemed a worse case for Thermal Cycle testing. ...
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... Series - Integrated Passive & Active Device using CSP Block Diagram Figure 4 contains a block diagram of the CSP device. This diagram includes the pin names and basic electrical connections associated with each channel. EXT1 ±6.5 V GROUND EXT2 ±6.5 V EXT3 ±6.5 V EXT4 ±6.5 V EXT5 ± ...
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... Series - Integrated Passive & Active Device using CSP Device Pin Out The Pin-Out for the device is shown in Fig. 6. Note also that the device is shown with bumps facing up. EXT10 EXT4 D EXT11 C EXT12 B EXT1 A EXT2 EXT3 EXT4 Fig. 6 (a) - Device Pin Out “Bumps Up” View Packaging The product will be dispensed in an 8mm x 4mm Tape and Reel format - see Fig ...