146777-5 TE Connectivity, 146777-5 Datasheet

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146777-5

Manufacturer Part Number

146777-5

Description

Manufacturer

TE Connectivity

Type

PCMCIAr

Datasheet

1.146777-5.pdf (1 pages)

Specifications of 146777-5

Gender

RCP

Mounting Style

Surface Mount

Termination Method

Solder

Body Orientation

Right Angle

Contact Pitch (mm)

1.27mm

Housing Material

Liquid Cryst Polymer

Number Of Contact Rows

2

Number Of Contacts

68POS

Contact Material

Beryllium Copper

Product Height (mm)

3.3mm

Product Depth (mm)

9.81mm

Product Length (mm)

47.5mm

Contact Pitch

0.05mm

Lead Free Status / RoHS Status

Not Compliant

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146777 - 5 Product Details

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146777

RECEPTACLE ASSEMBLY,CARDB

None Available

None Available

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Product Type

Number of Positions

Shielded

Mating Polarization

Holddowns = Without

Color = Black

Shield Material = Brass

Comment = I/O header should have the same

PCB offset as receptacle.

Lead Length (mm [in]) = 1.50 [0.059]

Solder Tail Contact Plating = Tin

PCB Offset (mm [in])

Lead Type

Number of Rows = Dual

Centerline (mm [in]) = 1.27 [0.050]

Shield Mating Area Plating = Gold (30) over

nickel (50)

Shield Plating = Tin

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= Surface Mount

= Receptacle

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= Without

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= 68

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5 of 6 EU RoHS/ELV Compliant

Receptacle

CardBus Application

PCB Offset = .41 mm

Lead Type = Surface Mount

leads

Number of Positions = 68

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2008 Tyco Electronics Corporation All Rights Reserved

Statement of Compliance

(PDF, English)

- Lead (100)

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Contact Mating Area Plating Material

(30) over Nickel (30)

Region = Americas

Contact Material = Beryllium Copper

Contact Underplating = Nickel (50)

Housing Material = Liquid Crystal Polymer

(LCP)

Housing Flammability Rating = UL 94V

RoHS/ELV Compliance

Compliant

Lead Free Solder Processes

capable to 245°C, Reflow solder capable to

260°C

Application

Packaging Method

Brand = AMP

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= ELV compliant, 5 of 6

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