2-1705300-1 TE Connectivity, 2-1705300-1 Datasheet - Page 77

• Manufacturer Part Number: 2-1705300-1
• Description: CONNECTOR, SIM, 2.1MM
• Manufacturer: TE Connectivity
• Type: SIMr

Specifications of 2-1705300-1

• Gender: M
• Mounting Style: Surface Mount
• Termination Method: Solder
• Body Orientation: Straight
• Contact Pitch (mm): 2.54mm
• Housing Material: Thermoplastic
• Number Of Contact Rows: 2
• Number Of Contacts: 6POS
• Contact Material: Copper Alloy
• Connector Type: SIM Socket
• Row Pitch: 7.3mm
• Pitch Spacing: 2.54mm
• No. Of Contacts: 6
• Contact Termination: Surface Mount Vertical
• No. Of Rows: 2
• Contact Plating: Gold Over Nickel
• Rohs Compliant: Yes
• Svhc: No
• Product Type: Connector
• Card Type: 2FF mini SIM
• Card Guide Slots: Without
• Pcb Mount Style: Surface Mount
• Contact Retention: No
• Connector Stabilization Ribs: Without
• Height Above Pc Board (mm [in]): 2.10 [0.083]
• Card Stop: Without
• Ejector Type: Push - Pull
• Centerline (mm [in]): 2.54 [0.100]
• Durability Rating: 5000 Cycles
• Contact Base Material: Selective Gold
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Card Insertion Style: Normal Insertion
• Card Detection Switch: Without
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

Mini SIM
Card Packaging
Tyco Electronics propose
a new Packaging for the
3
The leadframe is over moulded
with a plastic package at
dimension close to the final
Mini SIM card body.
This technology allows our
customers to work directly
on advanced product and
use their standard available
reel-to-reel equipments.
rd
Generation of SIM Cards
Products for Mobile Equipment
Mechatronic Center Niefern
Mini SIM Card Packaging
Key Features
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Produced with the Standard
Tyco Electronics Technologies
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Microelectronic can be made on semi final packaging, no module out cutting and embedding
operation.
Lower risk and process time improvement.
Personalisation can be realized separately on tapes, and bring together by a final operation.
No additional card body is needed, but also possibility to plug in 1
High-speed stamping
Selective plating
Laminating
Reel-to-reel over moulding
st
or 2
nd
card body generation.
Catalog 1654270-2
Revised 8-2007
75