AXH010A0Y-SRZ Lineage Power, AXH010A0Y-SRZ Datasheet - Page 14

• Manufacturer Part Number: AXH010A0Y-SRZ
• Description: DC/DC Converters & Regulators 1.8Vout 10A SMT 3-5.5Vin
• Manufacturer: Lineage Power
• Type: Step Downr
• Series: AXH010r

Specifications of AXH010A0Y-SRZ

• Output Current: 10A
• Input Voltage: 3 to 5.5V
• Output Voltage: 1.8V
• Screening Level: Industrial
• Product Length (mm): 33mm
• Product Depth (mm): 13.46mm
• Mounting Style: Surface Mount
• Pin Count: 6
• Number Of Outputs: 1
• Package / Case: SMT
• Product: Non-Isolated / POL
• Output Power: 18 W
• Input Voltage Range: 3 V to 5.5 V
• Output Voltage (channel 1): 1.8 V
• Output Current (channel 1): 10 A
• Output Type: Non-Isolated
• Lead Free Status / RoHS Status: Compliant

Data Sheet
March 28, 2008
Surface Mount Information
MSL Rating
The Austin Lynx
Storage and Handling
The recommended storage environment and handling proce-
dures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor life of the product at
conditions of £ 30°C and 60% relative humidity varies accord-
ing to the MSL rating (see J-STD-033A). The shelf life for dry
packed SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Figure 31. Recommended linear reflow profile using Sn/
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
Lineage Power
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Ag/Cu solder.
TM
SMT modules have a MSL rating of 1.
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
(continued)
Austin Lynx
Cooling
Zone
3.0 Vdc - 5.5 Vdc Input, 0.9 Vdc - 3.3 Vdc Output, 10 A
TM
SMT Non-Isolated dc-dc Power Modules:
14