BOXD510MO Intel (CPU), BOXD510MO Datasheet
BOXD510MO
Specifications of BOXD510MO
BOXD510MO Summary of contents
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Intel® Desktop Board D510MO Technical Product Specification ® The Intel Desktop Board D510MO may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel ...
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Revision History Revision Revision History -001 First release of the Intel Specification. This product specification applies to only the standard Intel identifier MOPNV10J.86A. Changes to this specification will be published in the Intel Desktop Board D510MO Specification Update before being ...
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Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board D510MO. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended ...
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Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1,073,741,824 bits) KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits ...
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Contents 1 Product Description 1.1 Overview.......................................................................................... 9 1.1.1 Feature Summary .................................................................. 9 1.1.2 Board Layout ....................................................................... 11 1.1.3 Block Diagram ..................................................................... 13 1.2 Online Support................................................................................ 14 1.3 Processor ....................................................................................... 14 1.3.1 Intel D510 Graphics Subsystem.............................................. 15 1.4 System Memory .............................................................................. ...
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Thermal Considerations .................................................................... 55 2.6.1 Passive Heatsink Design in a Passive System Environment ......... 57 2.7 Power Consumption ......................................................................... 60 2.7.1 Minimum Load Configuration.................................................. 60 2.7.2 Maximum Load Configuration ................................................. 60 2.8 Reliability ....................................................................................... 61 2.9 Environmental ................................................................................ 62 ...
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Figures 1. Major Board Components.................................................................. 11 2. Block Diagram ................................................................................ 13 3. LAN Connector LED Locations ............................................................ 22 4. Back Panel Audio Connectors ............................................................ 24 5. Thermal Sensors and Fan Header....................................................... 26 6. Location of the Standby Power Indicator LED ...
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Front Panel USB Header ................................................................... 47 25. Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support) ......................................................... 47 26. Power Connector ............................................................................. 48 27. Front Panel Header .......................................................................... 49 28. States for a One-Color ...
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Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of Intel Desktop Board D510MO. Table 1. Feature Summary Form Factor Mini-ITX, (6.7 inches by 6.7 inches [170 millimeters by 170 millimeters]) compatible with microATX Processor ...
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Table 1. Feature Summary (continued) • Intel BIOS • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS • Support for PCI* Local Bus Specification Revision 2.3 Instantly Available PC Technology • Suspend to RAM support ...
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Board Layout Figure 1 shows the location of the major components. Table 2 lists the components identified in Figure 1. Figure 1. Major Board Components 11 ...
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Table 2. Board Components Shown in Figure 1 Item/callout from Figure 1 Description Back panel connectors A Serial port header (COM 1) B Parallel port header C Serial port header (COM 2) D LVDS inverter power voltage selection jumper (optional) ...
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Block Diagram Figure block diagram of the major functional areas. Figure 2. Block Diagram 13 ...
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Online Support To find information about… Intel Desktop Board D510MO Desktop Board Support Available configurations for the Intel Desktop Board D510MO Chipset information BIOS and driver updates Integration information Tested memory 1.3 Processor The board has a passively-cooled, soldered-down ...
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Intel D510 Graphics Subsystem ® 1.3.1.1 Intel Graphics Media Accelerator 3150 Graphics Controller The Intel GMA 3150 graphics controller features the following: • 400 MHz core frequency • High quality texture engine ⎯ DX9.0c* and OpenGL* 1.4 compliant ⎯ ...
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System Memory The board has two 240-pin DDR2 DIMM sockets and supports the following memory features: • DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs • maximum total system memory • Minimum total ...
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Intel NM10 Express Chipset The Intel NM10 Express Chipset provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCIe interfaces. The Intel NM10 Express Chipset is a centralized controller for the board’s I/O paths. ...
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Configuration Modes For monitors attached to the VGA port, video modes supported by this board are based on the Extended Display Identification Data (EDID) protocol. Video mode configuration for LVDS displays is supported as follows: • Automatic panel identification ...
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USB The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The port arrangement is as follows: • Four ports are implemented with stacked back panel connectors • Three front ...
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Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, ...
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Parallel Port Header The parallel port header is implemented as a 26-pin header on the board. Use the BIOS Setup program to set the parallel port mode. For information about The location of the parallel port header 1.8 LAN ...
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RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 3). Figure 3. LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the ...
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Audio Subsystem The board supports the Intel High Definition Audio subsystem. The audio subsystem consists of the following: • Intel NM10 Express Chipset • Realtek ALC662 audio codec The audio subsystem has the following features: • Advanced jack sense ...
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Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Obtaining audio software and drivers 1.9.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back ...
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Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • Thermal and voltage monitoring • Chassis intrusion detection ...
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Thermal Monitoring Figure 5 shows the locations of the thermal sensors and fan header. Item Description A Chassis fan header B Thermal diode, located on the processor die C Remote thermal sensor Figure 5. Thermal Sensors and Fan Header ...
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Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan header ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ ...
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System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are ...
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Wake-up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8. Wake-up Devices and Events These devices/events can wake up the computer… LAN PME# signal Wake# signal Power ...
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Hardware Support The board provides several power management hardware features, including: • Power connector • Fan header • LAN wake capabilities • Instantly Available PC technology • Wake from USB • Wake from PS/2 devices • Power Management Event ...
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Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to- RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the hard drive(s) and fan will power off, ...
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V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 6 shows the location of the standby power indicator LED. CAUTION ...
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ENERGY STAR*, E-Standby, and EuP Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. ...
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Technical Reference 2.1 Memory Map 2.1.1 Addressable Memory The board utilizes addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset ...
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The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 7 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap ...
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Table 10 lists the system memory map. Table 10. System Memory Map Address Range Address Range (decimal) (hex) 1024 K - 4096 K 100000 - 400000 960 K - 1024 K F0000 - FFFFF 896 K - 960 K E0000 ...
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Connectors and Headers CAUTION Only the following connectors/headers have overcurrent protection: Back panel and front panel USB and PS/2. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as ...
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Back Panel 2.2.1.1 Back Panel Connectors Figure 8 shows the location of the back panel connectors. Item NOTE The back panel audio line out connector is designed to power headphones ...
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I/O Shield The I/O shield provided with the board allows access to all back panel connectors and is compatible with standard mini-ITX and microATX chassis added benefit for system configurations with wireless PCI Express Mini Card solutions, ...
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Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers 41 ...
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Table 11 lists the component-side connectors and headers identified in Figure 10. Table 11. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Description S/PDIF header A Serial port header (COM 1) B Parallel port header C ...
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Signal Tables for the Connectors and Headers Table 12. Serial Port Header (COM 1 and COM 2) Pin Signal Name 1 DCD (Data Carrier Detect) 3 TXD# (Transmit Data) 5 Ground 7 RTS (Request To Send (Ring ...
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Table 14. LVDS Panel Voltage Selection Jumper (Optional) Voltage Jumper Setting 3 and and and 4 Table 15. Chassis Fan Header Pin Signal Name 1 Ground 2 +12 V (PWM ...
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Table 17. LVDS Inverter Power Connector (Optional) Pin Signal Name Description 1 GND Ground 2 GND Ground 3 5 V/12 V Inverter power 4 5 V/12 V Inverter power 5 INV_RATING Inverter rating 6 BKLT_PWM Backlight PWM 7 BKLT_EN Backlight ...
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Table 19. Parallel Port Header Pin Standard Signal Name 1 STROBE# 2 AUTOFD# 3 PD0 4 FAULT# 5 PD1 6 INT# 7 PD2 8 SLCTIN# 9 PD3 10 GROUND 11 PD4 12 GROUND 13 PD5 14 GROUND 15 PD6 16 ...
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Table 22. Front Panel Audio Header for Intel HD Audio Pin Signal Name 1 [Port 1] Left channel 3 [Port 1] Right channel 5 [Port 2] Right channel 7 SENSE_SEND (Jack detection) 9 [Port 2] Left channel Table 23. Front ...
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Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x1 Mini Card (rev 1.2 compliant) connector • PCI Conventional (rev 2.3 compliant) bus connector Note the following considerations for the PCI Conventional bus connector: ...
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Front Panel Header This section describes the functions of the front panel header. Table 27 lists the signal names of the front panel header. Figure connection diagram for the front panel header. Table 27. Front Panel ...
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Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the ...
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Front Panel USB Headers Figure 12 and Figure 13 are connection diagrams for the front panel USB headers. NOTE • The +5 VDC power on the USB headers is fused. • Use only a front panel USB connector that ...
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BIOS Configuration Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure ...
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Table 29. BIOS Configuration Jumper Settings Function/Mode Jumper Setting Normal 1 Configure 2 Recovery None Configuration The BIOS uses current configuration information and passwords for booting. After the POST runs, Setup ...
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Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a mini-ITX or microATX form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 ...
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Electrical Considerations 2.5.1 Fan Header Current Capability Table 30 lists the current capability of the fan header. Table 30. Fan Header Current Capability Fan Header Chassis fan 2.5.2 Add-in Board Considerations The board is designed to provide 2 A ...
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CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 16) can reach a temperature of ...
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Table 31. Thermal Considerations for Components Component Intel Atom processor Processor voltage regulator area Intel NM10 Express Chipset Memory DIMM For information about Processor datasheets and specification updates 2.6.1 Passive Heatsink Design in a Passive System Environment This section highlights ...
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Thermal Specifications Guideline Terms Requirements T ≤ 50 ° ≤ 100 °C J Ψ ≤ 3.85 °C/W JA TIM Honeywell PCM45F TDP external ≤ 35 °C A 2.6.1.3 Heatsink Design Guideline Maximum heatsink size* ...
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Figure 17. Fan Location Guide for Cassis Selection (Chassis Orientation is Not Restricted) For all chassis configurations, the heatsink performance parameter, Ψ than 3.85 °C/W. The detail thermal measurement metrology is described in the TMSDG. For chassis that fail to ...
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Power Consumption Power measurements were performed to determine bare minimum and likely maximum power requirements from the board, as well as attached devices, in order to facilitate power supply rating estimates for specific system configurations. 2.7.1 Minimum Load Configuration ...
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USB keyboard and mouse • Back and front panel host-powered USB devices (other than keyboard and mouse) ⎯ Load: continuous read/write activity on external drive/peripheral • LAN linked at 1 Gbps ⎯ Load: continuous read/write benchmark on remote share ...
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Environmental Table 34 lists the environmental specifications for the board. Table 34. Intel Desktop Board D510MO Environmental Specifications Parameter Specification Temperature Non-Operating -20 °C to +70 °C Operating 0 °C to +50 °C Shock Unpackaged 50 g trapezoidal waveform ...
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Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup ...
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Table 35 lists the BIOS Setup program menu features. Table 35. BIOS Setup Program Menu Bar Maintenance Main Clears Displays passwords and processor displays and memory processor configuration information Table 36 lists the function keys available for menu screens. Table ...
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System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system ...
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Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating ...
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BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ® • Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. ...
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Custom Splash Screen ® During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel available from Intel can be used to create a custom splash screen. ...
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Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: • Video adapter • Keyboard ...
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BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for ...
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Board Status and Error Messages 4.1 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 40). Table 40. BIOS Beep Codes Type ...
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Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 41). Table 41. Front-panel Power LED Blink Codes ...
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Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is ...
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Table 44. Port 80h POST Codes POST Code Description of POST Operation 10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization 21 Initializing a ...
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Table 44. Port 80h POST Codes (continued) POST Code Description of POST Operation 90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self ...
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Table 44. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Option ROMs Runtime Phase/EFI OS Boot F4 Entering Sleep state ...
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Table 45. Typical Port 80h POST Sequence POST Code Description 21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading recovery capsule E4 Entered DXE ...
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Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board D510MO: • Safety standards • European Union Declaration of Conformity statement • Product Ecology statements • Electromagnetic Compatibility ...
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European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board D510MO is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European ...
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Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC a 2006/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt ...
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Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su ...
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Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт ...
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Table 47. Lead-Free Board Markings Description Lead-Free 2 nd Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the board substrate and the solder connections from the ...
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EMC Regulations Intel Desktop Board D510MO complies with the EMC regulations stated in Table 48 when correctly installed in a compatible host system. Table 48. EMC Regulations Regulation FCC 47 CFR Part 15, Subpart B ICES-003 Issue 4 EN55022:2006 ...
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Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Intel Desktop Board D510MO has ...
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Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la ...
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PRECAUCIÓN Existe peligro de explosió pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones ...
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AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy ...
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