MT48LC4M16A2TG-75 IT:G Micron Technology Inc, MT48LC4M16A2TG-75 IT:G Datasheet - Page 34
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MT48LC4M16A2TG-75 IT:G
Manufacturer Part Number
MT48LC4M16A2TG-75 IT:G
Description
DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC4M16A2TG-75_ITG.pdf
(72 pages)
Specifications of MT48LC4M16A2TG-75 IT:G
Density
64 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
-40 to 85 °C
Organization
4Mx16
Address Bus
14b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
140mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Not Compliant
Power-Down
Figure 24:
Figure 25:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
Terminating a WRITE Burst
PRECHARGE Command
Note:
Power-down occurs if CKE is registered LOW coincident with a NOP or COMMAND
INHIBIT when no accesses are in progress. If power-down occurs when all banks are
idle, this mode is referred to as precharge power-down; if power-down occurs when
there is a row active in any bank, this mode is referred to as active power-down. Entering
power-down deactivates the input and output buffers, excluding CKE, for maximum
power savings while in standby. The device may not remain in the power-down state
longer than the refresh period (
performed in this mode.
The power-down state is exited by registering a NOP or COMMAND INHIBIT and CKE
HIGH at the desired clock edge (meeting
COMMAND
A0–A9
BA0,1
RAS#
CAS#
ADDRESS
WE#
CKE
CLK
A10
CS#
DQMs are LOW.
CLK
TRANSITIONING DATA
DQ
HIGH
VALID ADDRESS
BANK,
WRITE
COL n
D
T0
n
IN
TERMINATE
Bank Selected
BURST
T1
All Banks
ADDRESS
BANK
DON’T CARE
COMMAND
(ADDRESS)
(DATA)
NEXT
T2
34
DON’T CARE
t
REF or
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
REF
t
CKS). See Figure 26 on page 35.
AT
) since no refresh operations are
64Mb: x4, x8, x16 SDRAM
©2000 Micron Technology, Inc. All rights reserved.
Commands