MCS04020C4701FE000 Vishay, MCS04020C4701FE000 Datasheet - Page 3

• Manufacturer Part Number: MCS04020C4701FE000
• Description: Res Thin Film 0402 4.7K Ohm 1% 1/16W ±50ppm/°C Molded SMD Paper T/R
• Manufacturer: Vishay
• Type: Thin Filmr
• Series: MCS 0402r

Specifications of MCS04020C4701FE000

• Case Size: 0402
• Resistance Value: 4.7 KOhm
• Power Rating: 1/16 W
• Tolerance: 1 %
• Resistance (ohms): 4.7K
• Number Of Terminations: 2
• Package / Case: 0402 (1005 Metric)
• Power (watts): 0.063W, 1/16W
• Composition: Thin Film
• Temperature Coefficient: ±50ppm/°C
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height: 0.013" (0.32mm)
• Lead Style: Surface Mount (SMD - SMT)
• Resistance In Ohms: 4.70K
• Case: 0402 (1005 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 2312 275 14702; 2312 275 14702; 231227514702; MCS0402-4.70K-CFTR

DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
Document Number: 28705
Revision: 20-Nov-09
DIMENSIONS AND MASS
TYPE
MCS 0402
MCT 0603
MCU 0805
MCA 1206
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
MCS 0402
MCT 0603
MCU 0805
MCA 1206
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the
reliability of the assembly.
Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on board materials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.
0.45 + 0.1/- 0.05
0.45 + 0.1/- 0.05
0.32 ± 0.05
0.55 ± 0.1
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
(mm)
0.55
0.80
1.40
(mm)
G
-
H
3.2 ± 0.1/- 0.2
(mm)
WAVE SOLDERING
1.55 ± 0.05
1.10
1.25
1.50
1.0 ± 0.05
2.0 ± 0.1
Professional Thin Film Chip Resistors
Y
-
(mm)
H
For technical questions, contact:
L
W W
T
(mm)
1.10
1.50
1.90
T
X
2
-
1.25 ± 0.15
0.5 ± 0.05
0.85 ± 0.1
1.6 ± 0.15
(mm)
W
T
1
Z
(mm)
2.75
3.30
4.40
L
Z
-
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
G
[e-mail]
(mm)
W
T
Y
(mm)
0.35
0.65
0.90
1.50
G
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
(mm)
T
1
REFLOW SOLDERING
X
(mm)
0.55
0.70
0.90
1.15
Y
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
Vishay Beyschlag
0.2 ± 0.1
(mm)
T
2
(mm)
0.55
0.95
1.40
1.75
X
www.vishay.com
MASS
(mg)
(mm)
0.6
1.9
4.6
9.2
1.45
2.05
2.70
3.80
Z
193