MMBT2132T3 ON Semiconductor, MMBT2132T3 Datasheet - Page 4

TRANS SS GP NPN 30V 700MA SC74-6

MMBT2132T3

Manufacturer Part Number
MMBT2132T3
Description
TRANS SS GP NPN 30V 700MA SC74-6
Manufacturer
ON Semiconductor
Datasheet

Specifications of MMBT2132T3

Transistor Type
NPN
Current - Collector (ic) (max)
700mA
Voltage - Collector Emitter Breakdown (max)
30V
Vce Saturation (max) @ Ib, Ic
400mV @ 70mA, 700mA
Dc Current Gain (hfe) (min) @ Ic, Vce
150 @ 100mA, 3V
Power - Max
342mW
Mounting Type
Surface Mount
Package / Case
SC-74-6
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Collector Cutoff (max)
-
Frequency - Transition
-
Other names
MMBT2132T3OS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMBT2132T3
Manufacturer:
ON
Quantity:
3 428
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.05 (0.002)
H
E
e
A1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
1
D
5
2
3
4
*For additional information on our Pb−Free strategy and soldering
0.028
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.7
b
A
E
0.074
1.9
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
L
0.039
http://onsemi.com
1.0
MMBT2132T3
CASE 318F−05
ISSUE L
SC−74
C
0.094
2.4
4
q
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. 318F−01, −02, −03 OBSOLETE. NEW
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
STANDARD 318F−04.
STYLE 2:
PIN 1. NO CONNECTION
DIM
H
A1
A
D
b
c
E
e
L
q
E
2. COLLECTOR
3. EMITTER
4. NO CONNECTION
5. COLLECTOR
6. BASE
inches
0.037
0.037
mm
0.95
0.95
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
MIN
MILLIMETERS
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NOM
1.00
0.06
0.37
0.18
3.00
1.50
0.95
0.40
2.75
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.051
0.034
0.008
0.099
0.114
MIN
MMBT2132T1/D
INCHES
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
NOM
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°

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