120787-1 TE Connectivity, 120787-1 Datasheet - Page 2

• Manufacturer Part Number: 120787-1
• Description: Conn Hard Metric RCP 30 POS 2.5mm Press Fit RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Hard Metricr

Specifications of 120787-1

• Pitch: 2.5 mm
• Number Of Rows: 6
• Number Of Contacts: 30
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Palladium Nickel Over Nickel
• Product Type: Connector
• Connector Type: Connector Assembly
• Pcb Mounting Orientation: Right Angle
• Module Type: Center
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Termination Post Length (mm [in]): 2.27 [0.089]
• Card Slot Pitch (mm [in]): 25.4 [1]
• Rows Per Connector: 6
• Columns Per Connector: 5
• Number Of Signal Contacts: 30
• Centerline (mm [in]): 2.00 [0.079]
• Contact Type: Socket
• Contact Style: Press Fit, Short Tail
• Contact Base Material: Copper Alloy
• Contact Plating, Mating Area, Material: Conforms to Performance Requirements of TE Connectivity Product Specification 108-1957; Based on Telcordia GR-1217-CORE, Applications in Uncontrolled Environments
• Connector Style: Receptacle
• Housing Material: Polyester GF
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant

46
Product Line Overview
Product Facts
Applications
Catalog 1773095
Issued 4-05
www.tycoelectronics.com
High speed, high density
two piece board-to-board
backplane connector
Dual beam provides
redundant contact for
improved reliability
For data rates of 6.2+ Gb/s
10 row, 100 high speed
lines per 25.00 [.984]
6 row, 60 high speed lines
per 25.00 [.984]
Controlled impedance:
50 ohm Single Ended
100 ohm Differential
Feedthrough versions for
midplane applications
250 mating cycles
End stackable on 2.50
[.098] centerline, signal pin
to signal pin
Advanced ESD/Power (10
Amps) using optional guide
pins and power contacts
High Speed
Telecommunications
Equipment
Mid-range and high-end
services
Recognized under the
Component Program
of Underwriters
Laboratories Inc.,
File No. E28476
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are U.S. equivalents.
R
High Speed Backplane Connectors
Z-PACK HS3 Connector
The emergence of high
speed serial backplanes
has forced interconnections
to be able to transfer data
at gigabit speeds.
The Z-PACK HS3 connector
system has been specifi-
cally designed to support
this generation of high
speed serial data transfer.
Tyco Electronics has incor-
porated a controlled imped-
ance microstrip path through
the connector to minimize
signal degradation and
Availability
http://hs3.tycoelectronics.com
Technical Documents
Product Specification
108-1957
Application Specification
114-13020
Qualification Test Report
501-501
Fully validated SPICE models: E-mail requests to [e-mail]
Samples: go to http://tycoelectronics.custhelp.com
Pro/E models and IGES models: E-mail requests to [e-mail]
White Papers: available on product website at http://hs3.tycoelectronics.com
Electrical Performance Report: http://hs3.tycoelectronics.com
Routing Guide: http://hs3.tycoelectronics.com
Dimensions are shown for
reference purposes only.
to change.
Routing Guide #20GC004-1
Specifications subject
crosstalk. Compliant pins
are used on both daughter-
card and backplane.
This connector family is
press fit and is compatible
with other Z-PACK HM
family connectors on the
same board edge. Z-PACK
HS3 connectors support
data rates of 6.2+ Gb/s per
differential pair. The 6 row
version is optimized for
20.32mm or 0.8 inch card
centerline applications,
while the 10 row version is
6 row EPR #1308505; 10 row EPR #1308506
Material and Finish
Contact Area Finish — 0.80µm Au
min. over 1.3µm Ni min.
Compliant Pin Finish — 0.8µm
SnPb min. over 1.3µm Ni min.
Contact — Copper Alloy
Housing — Glass filled polyester,
94V-0 rated
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
optimized for high density
for 25.4mm or 1.0 inch card
centerline applications.
The Tyco Electronics
Universal Power Module
(UPM) is designed to be
compatible with the Z-PACK
HS3 connector.
Static Discharge Guide/
Power Pins, Guide Pin/
Power Receptacles,
Universal Guide Pin and
Receptacles, and Coding
Keys (10 row only) are also
available.
Ratings
Current — 1.15A per fully energized
Operating Voltage — 250 VAC max.
Temperature — –65°C to 105°C
Mating Force — 0.75N max. per
contact (signal = 1 contact, ground =
1 contact)
Durability — 250 cycles
* Reference Product Spec. 108-1957 for
complete list of performance data.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967