536254-6 TE Connectivity, 536254-6 Datasheet - Page 2

Conn Backplane RCP 140 POS 1.27mm Solder ST Thru-Hole

536254-6

Manufacturer Part Number
536254-6
Description
Conn Backplane RCP 140 POS 1.27mm Solder ST Thru-Hole
Manufacturer
TE Connectivity
Type
Backplaner
Datasheet

Specifications of 536254-6

Pitch
1.27 mm
Number Of Rows
2
Number Of Contacts
140
Termination Method
Solder
Mounting
Through Hole
Contact Plating
Gold Over Nickel
Rohs Compliant
NO
Product Type
Connector
Mount Angle
Vertical
Termination Method To Pc Board
Through Hole - Solder
Pcb Mount Retention
Without
Guides
Without
Flame Retardant
Yes
Bus Bar Material
Phosphor Bronze
Tail Length (mm [in])
3.18 [0.125]
Bus Bar Mating Area Plating
Gold (30)
Bus Bar Termination Area Plating
Tin-Lead with Nickel underplated
Number Of Positions
140
Signal Contact Material
Phosphor Bronze
Signal Contact Mating Area Plating
Gold (30)
Signal Contact Termination Area Plating
Tin-Lead with Nickel underplated
Connector Style
Receptacle
Housing Material
High Temperature Thermoplastic
Stack Height (mm [in])
10.92 [0.430], 18.75 [0.738]
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
536254-6
Manufacturer:
TE Connectivity AMP Connectors
Quantity:
401
Part Number:
536254-6
Manufacturer:
TYCO
Quantity:
35 804
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Tyco Electronics Micro-Strip
connectors are a high
density, controlled
impedance connector
family compatible with the
requirements of high den-
sity and high speed data
transmission technologies.
Each signal line within the
mated connector is located
at a specific distance from
an integral, separable bus
bar serving as a ground
plane in a micro-strip
configuration. The selection
of housing dielectric,
spacing from signal
contact-to-ground plane
and conductor geometry
provide a specific charac-
teristic impedance plus
very low inductance and
capacitance.
Discontinuities resulting
from connector structure
and solder interfaces are
dimensionally small and
therefore appear transpar-
ent to high speed signals.
Both vertical and right-
angle board-to-board and
cable-to-board connector
versions share a nominal
impedance of 50 ohms
(single ended) or 100 ohms
(differential pair).
Each one inch length of
connector houses two elec-
trically isolated high current
contacts. When soldered to
the PC board ground plane,
that ground plane is
extended through the
mated connector.
Resistance is minimized
by a large contact area and
short electrical length, pro-
viding signal return paths
with negligible ground loop
voltages. Since signal
return is via the bus bars,
signal-ground-signal
alternation, common to
high speed applications,
becomes unnecessary. All
contacts can be dedicated
to signal transmission,
effectively doubling
connector density.

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