5536649-1 TE Connectivity, 5536649-1 Datasheet - Page 5

Conn Backplane RCP 10Power POS 2mm Press Fit RA Thru-Hole

5536649-1

Manufacturer Part Number
5536649-1
Description
Conn Backplane RCP 10Power POS 2mm Press Fit RA Thru-Hole
Manufacturer
TE Connectivity
Type
Backplaner
Series
Z-PACKr
Datasheet

Specifications of 5536649-1

Pitch
2 mm
Number Of Rows
5
Number Of Contacts
10Power
Termination Method
Press Fit
Mounting
Through Hole
Contact Plating
Gold Over Nickel
Pitch (mm)
2mm
Gender
RCP
Body Orientation
Right Angle
Number Of Contact Rows
5
Mounting Style
Through Hole
Voltage Rating Max
30VAC
Current Rating (max)
5/ContactA
Contact Material
Phosphor Bronze
Housing Material
Liquid Cryst Polymer
Product Height (mm)
13.8mm
Product Depth (mm)
22.45mm
Product Length (mm)
11.88mm
Connector Type
Backplane
Row Pitch
2mm
Pitch Spacing
2mm
No. Of Contacts
10
Contact Termination
Right Angle Through Hole
No. Of Rows
5
Rohs Compliant
Yes
Number Of Positions / Contacts
10
Mounting Angle
Right
Termination Style
Press In
Product Type
Connector
Pcb Mounting Orientation
Right Angle
Post Type
Solder Post
Module Type
Power
Number Of Power Positions
10
Voltage Rating (vac)
30
Termination Post Length (mm [in])
3.56 [0.140]
Sequencing
No
Post Plating
Tin
Centerline, Matrix (mm [in])
2.00 x 2.00 [.079 x .079]
Contact Type
Socket
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold (30)
Connector Style
Receptacle
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Applies To
Printed Circuit Board
Application
Free-Board
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant
14
Board-Mount Connectors
See Cable Connectors on Pages 19-28
Catalog 1773096
Revised 2-10
www.tycoelectronics.com
80
70
60
50
40
30
20
10
0
0
5
10
1 Contact
15
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Current per Contact (Amps)
20
25
8 Adjacent Contacts
Power Connectors & Interconnection Systems
MULTI-BEAM XL Power Distribution Connector Systems
Specifications
Materials
Housing — High temperature thermo-
plastic, UL 94V-0
Power Contacts — High conductivity
Copper alloy
Signal Contacts — Copper alloy
Boardlocks — Phosphor bronze
Finish
Power and Signal Contacts —
30 microinches [.76 micrometers] min.
gold over 50 microinches [1.27
micrometers] min. nickel on mating
surfaces, 100 microinches [2.54
micrometers] min. tin over 50
microinches [1.27 micrometers] min.
nickel at PCB terminations
Note: Tin-lead plating also available on
press-fit connectors
30
35
40
45
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
50
55
Performance Specifications
Up to 55 Amps per power contact,
de-rated to 35 Amps in equally ener-
gized (8 adjacent positions) connector.
Up to 4 Amps per signal contact,
de-rated to 1.5 Amps in equally
energized 24-position pin field.
Maximum Continuous Operating
Temperature — 105°C.
Contact Resistance — 0.7 milli-ohm
Durability — 250 cycle
Radial Mis-alignment Capability —
± 0.075″ [1.91 mm]
Minimum of 0.100″ [2.45 mm] of
contact wipe on shortest signal contact
30
25
20
15
10
5
0
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
1
Performance @ 30 Amps per Contact
Power Contacts on .250" [6.35mm]
2
4
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666
6
(Continued)
8
10

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