645169-3 TE Connectivity, 645169-3 Datasheet - Page 116

• Manufacturer Part Number: 645169-3
• Description: Conn Card Edge SKT 104 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Card Edger

Specifications of 645169-3

• Number Of Contacts: 104
• Contact Plating: Nickel
• Mounting: Through Hole
• Termination Method: Solder
• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contact Rows: 2
• Body Orientation: Straight
• Contact Material: Phosphor Bronze
• Mounting Style: Through Hole
• Product Height (mm): 15.49mm
• Operating Temp Range: -55C to 85C
• Pitch (mm): 2.54mm
• Housing Material: Polyester
• Housing Color: Black
• Current Rating (max): 3/ContactA
• Voltage Rating Max: 1000VAC
• Contact Resistance Max: 10
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Rohs Compliant: No
• Product Type: Connector
• Product Series: Standard Edge II
• Type Of Connector: Special 18/31 Dual Combination
• Number Of Dual Positions: 52
• Post Type: Solder Post
• Pcb Mounting Orientation: Vertical
• Mounting Ears: Without
• Pcb Mount Retention: Without
• High Current: No
• Termination Post Length (mm [in]): 3.18 [0.125]
• Solder Tail Contact Plating: Tin
• Centerline (mm [in]): 2.54 [0.100]
• Retention Latch: Without
• Positions Unloaded: None
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Underplate Material: Nickel
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Lead Free Status / RoHS Status: Not Compliant

116
Product Facts
Performance Specifications
Current Rating*:
3 amperes max.
Mating Force (Contact Pair):
1 lb. [4.4 N] max.
Durability (Mating Cycles):
100 min.
Termination Resistance:
12 milliohms max.
Dielectric Rating:
1200 VAC (rms)
Insulation Resistance:
5000 megohms max.
Operating Temperature:
–55°C to +85°C
*Consult Tyco Electronics
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
when paralleling contacts
for power applications.
High density - .0625 [1.586]
contact centerlines
Compliant ACTION PIN
contacts press-fit into
plated-through holes for
solderless application
Individually replaceable
contacts
Accommodates up to three
levels of daughter card pads
for sequencing
.125 [3.18] square grid post
arrangement
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
The high performance AMP
TELEDENSITY connector is
a high density, card edge,
telecommunications con-
nector. It features compliant
ACTION PIN contacts for
solderless application to
multi-layer printed circuit
boards with plated-through
or bare copper holes.
These connectors accept
.054 to .072 [1.37 to 1.83]
thick daughter cards. To
satisfy the broadest range
of application needs, the
Card Edge Connectors
(Press-Fit Board-To-Board)
TELEDENSITY Connectors
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
contacts are plated with 30
microinches of gold in the
mating area and tin-lead on
the posts. A plastic locating
strip keeps posts positioned
correctly for board insertion.
For high-density needs,
TELEDENSITY connectors
offer a .0625 [1.586] daugh-
ter card contact centerline
spacing in 39-, 71-, or 99-
dual positions. The connec-
tor’s .330 [8.38] slot depth
accommodates up to three
levels of daughter card
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
pads for sequencing, while
a biasing wedge maintains
proper pad alignment dur-
ing card extraction. Posts
are arranged in a .125
[3.18] square grid to ease
circuit routing.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967