MC10H644FN ON Semiconductor, MC10H644FN Datasheet - Page 5

• Manufacturer Part Number: MC10H644FN
• Manufacturer: ON Semiconductor

Specifications of MC10H644FN

• Lead Free Status / RoHS Status: Not Compliant

C
−L−
0.010 (0.250)
20
Z
G1
S
G
T
1
−N−
L−M
S
A
R
V
N
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
7. DIMENSION H DOES NOT INCLUDE DAMBAR
VIEW S
−M−
S
E
Y BRK
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
MEASURED AT DATUM −T−, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
Y14.5M, 1982.
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
J
0.007 (0.180)
0.007 (0.180)
−T−
W
0.004 (0.100)
SEATING
PLANE
M
M
PACKAGE DIMENSIONS
D
PLASTIC PLCC PACKAGE
D
T
T
L−M
L−M
http://onsemi.com
CASE 775−02
S
S
FN SUFFIX
PLCC−20
ISSUE D
B
N
N
Z
S
S
5
VIEW D−D
U
0.007 (0.180)
K1
X
DIM
G1
K1
A
B
C
G
H
K
R
U
W
E
F
J
V
X
Y
Z
0.007 (0.180)
K
0.385
0.385
0.165
0.090
0.013
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.310
0.040
MIN
−−−
0.050 BSC
2
INCHES
M
_
T
VIEW S
0.395
0.395
0.180
0.019
0.032
0.356
0.356
0.048
0.048
0.056
0.020
0.330
0.110
MAX
−−−
−−−
10
−−−
L−M
_
M
G1
T
MILLIMETERS
MIN
9.78
9.78
4.20
2.29
0.33
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
7.88
1.02
−−−
S
1.27 BSC
2
L−M
_
F
H
N
10.03
10.03
MAX
4.57
2.79
0.48
0.81
9.04
9.04
1.21
1.21
1.42
0.50
8.38
S
−−−
−−−
10
−−−
0.010 (0.250)
S
_
0.007 (0.180)
N
0.007 (0.180)
S
S
T
M
M
L−M
T
T
L−M
L−M
S
S
N
S
S
N
N
S
S