747301-2 TE Connectivity, 747301-2 Datasheet - Page 2

• Manufacturer Part Number: 747301-2
• Description: Conn D-Subminiature RCP 37 POS 2.77mm Solder ST Thru-Hole 37 Terminal 1 Port
• Manufacturer: TE Connectivity
• Type: D-Subminiaturer

Specifications of 747301-2

• Gender: RCP
• Pitch: 2.77 mm
• Termination Method: Solder
• Mounting: Through Hole
• Body Orientation: Straight
• Peak Reflow Compatible (260 C): No
• Body Material: Steel
• Leaded Process Compatible: No
• Contact Plating: Gold
• Connector Type: D Sub
• Rohs Compliant: No
• Pcb Mounting Orientation: Vertical
• Product Series: HD 20
• Mating Connector Lock: Without
• Pcb Mount Retention: With
• Shell Type: Front Metal Shell
• Shell Size: 4
• Grounding Indents: Without
• Grounding Straps: Without
• Pcb Mount Style: Through Hole
• Color Code: None
• Sealed: No
• Profile: Standard
• Post Size (mm [in]): 0.66 [.026]
• Mounting Hole Diameter (mm [in]): 3.05 [.120]
• Shell Material: Steel
• Panel Mount Retention: Without
• Grounding Clips: Without
• Termination Post Length (mm [in]): 3.18 [0.125]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Number Of Positions: 37
• Pcb Mount Retention Type: Mounting Holes
• Shell Plating: Tin
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Shape: Round
• Contact Base Material: Phosphor Bronze
• Connector Style: Receptacle
• Ul Flammability Rating: UL 94V-0
• Housing Material: Thermoplastic - GF
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Not suitable for lead free processing
• Pcb Thickness, Recommended (in [mm]): 0.062 – 0.093 [1.57 – 2.36]
• Application: Standard

3.4.
3.5.
Rev C
Exam ination of product.
Term ination resistance, dry circuit.
Insulation resistance.
Dielectric withstanding voltage.
Tem perature rise vs current.
Solderability.
Vibration, random .
Physical shock.
Perform ance and Test Description
Product is designed to m eet the electrical, m echanical and environm ental perform ance requirem ents
specified in Figure 1. All tests are perform ed at am bient tem perature unless otherwise specified.
Test Requirem ents and Procedures Sum m ary
Test Description
15 m illiohm s m axim um initial.
Meets requirem ents of product
drawing and applicable Application
Specification.
20 m illiohm s m axim um final.
5000 m egohm s m inim um initial.
1000 m egohm s m inim um final
within 5 hours after testing.
1 kvac dielectric withstanding
voltage. 1 m inute hold. 1
m illiam pere m axim um leakage
current.
30 C m axim um tem perature rise at
specified current. 70 C m axim um
am bient.
Solderable area shall have a
m inim um of 95% solder coverage.
No discontinuities greater than 1
m icrosecond.
See Note (a).
No discontinuities greater than 1
m icrosecond.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirem ent
Visual, dim ensional and functional
per applicable Quality Inspection
plan.
TE Spec 109-6-1.
Subject m ated contacts assem bled
in housings to 50 m v open circuit at
100 m a m axim um .
See Figure 3.
TE Spec 109-28-4.
Test between adjacent contacts of
unm ated assem blies.
TE Spec 109-29-1.
Test between adjacent contacts of
unm ated assem blies.
TE Spec 109-45-1.
Measure tem perature rise vs
current.
See Figure 4.
TE Spec 109-11-1.
Subject tin-lead plated contact
posts to solderability.
TE Spec 109-21-5, Level F,
20 m inute duration.
Subject m ated connectors to 20 G's
rm s with 100 m a current applied.
See Figure 3.
TE Spec 109-26-1.
Subject m ated connectors to 50 G's
half-sine shock pulses of 11
m illiseconds duration. 3 shocks in
each direction along 3 m utually
perpendicular planes, 18 total
shocks.
See Figure 3.
Procedure
108-40025
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