5-146256-7 TE Connectivity, 5-146256-7 Datasheet - Page 311

• Manufacturer Part Number: 5-146256-7
• Description: Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU Mod IIr

Specifications of 5-146256-7

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 14
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Pitch Spacing: 2.54mm
• No. Of Rows: 2
• No. Of Contacts: 14
• Contact Termination: Through Hole
• Contact Material: Phosphor Bronze
• Rohs Compliant: Yes
• Agency Approvals: CSA, UL
• Angle: Straight
• Brand/series: AMPMODU/MOD II Series
• Color: Black
• Current, Rating: 3 A
• Flammability Rating: UL94V-0
• Length, Overall: 0.684 "
• Length, Pin: 0.23 "
• Material, Contact: Phosphor Bronze
• Material, Housing: Thermoplastic
• Pin Spacing: 0.1 "
• Primary Type: Interconnect System
• Special Features: Breakaway
• Temperature, Operating: -65 to +105 °C
• Termination: Thru-Hole
• Product Type: Connector
• Mount Angle: Vertical
• Pcb Mount Retention: Without
• Surface Mount Compatible: Yes
• Board Standoff: With
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 3.05 [0.120]
• Solder Tail Contact Plating: Tin over Nickel, Matte Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 14
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Housing Material: Thermoplastic - GF
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Operating Temperature (°c): -65 – +105
• High Temperature Housing: Yes
• High Speed Serial Data Connector: No
• Lead Free Status / Rohs Status: RoHS Compliant part

Catalog 1307819
Revised 8-08
www.tycoelectronics.com
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Performance Specifications
Dual In-Line Package (DIP) Shunts — 7600 Series
Current Rating —
Standard pressure — 2 amperes for +20˚C rise above ambient (one conductor per shunt
Machine insertable — 1 ampere for +20˚C rise above ambient (one conductor per shunt)
Insulation Resistance — 1x 10
Dielectric Withstanding Voltage — 500 VDC min.
Capacitance — 2 picofarads max. between adjacent straps
Temperature Rating — -55˚C to +105˚C
Terminal Strength (Bend Test) — Two 45˚ bend cycles per MIL-STD-202, Method 211, Condition B
Solder Bridging —
Cut straps can be reconnected by solder bridging. Solder bridging recommendations are:
Post Shunts
Current Rating —
3 amperes max. unless otherwise noted
Temperature Rating — -65˚C to +105˚C (gold) -40˚C to +85˚C (tin)
Technical Documents
Various technical documents are available for your use:
Product Specifications describe technical performance characteristics and verification
tests. They are intended for the Design, Component and Quality Engineer.
108-7533
108-1445
108-1476
108-1674
108-9057
108-9062
108-37006
Application Specifications describe requirements for using the product in its intended
application and/or crimping information. They are intended for the Packaging and Design
Engineer and the Machine Setup Person.
114-1045
114-1054
114-1059
114-1074
Instruction Sheets provide instructions for assembling or applying the product. They are
intended for the Manufacturing Assembler or Operator.
408-7768
408-3208
408-3230
408-3251
408-3276
•Use low temperature solder (60/40 tin/lead)
•Use solder tip approximately 1/32 [0.79] in diameter
•Do not let solder tip come in contact with plastic material
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Dual In-Line Package (DIP) Shunts
2mm Mini Shunt
Economy Shunt, Multiposition Shunt
Dual Beam Shunt
Low Profile Shunt
Tandem Spring Shunt
Novo Shunt with Handle
Tandem Spring Shunt
Dual In-Line Package (DIP) Shunts
Economy Shunt, Dual Beam Shunt, Low Profile Shunt, Multiposition
Shunt
2mm Mini Shunt
Dual In-Line Package (DIP) Shunts
Tandem Spring Shunt
Economy Shunt, Dual Beam Shunt, Low Profile Shunt
Multiposition Shunt
2mm Mini Shunt
10
ohms min. at 100 VDC
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208a
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