643813-4 TE Connectivity, 643813-4 Datasheet - Page 69

• Manufacturer Part Number: 643813-4
• Description: Conn IDC Connector F 4 POS 2.54mm IDT RA Cable Mount Loose Piece
• Manufacturer: TE Connectivity
• Type: IDC Connectorr
• Series: MTA-100r

Specifications of 643813-4

• Pitch: 2.54 mm
• Number Of Rows: 1
• Number Of Contacts: 4
• Gender: F
• Contact Plating: Tin-Lead Over Nickel
• Termination Method: IDT
• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• No. Of Contacts: 4
• No. Of Rows: 1
• Pitch Spacing: 2.54mm
• Rohs Compliant: No
• Agency Approvals: CSA, UL
• Angle: Right
• Application: Wire-to-board
• Brand/series: MTA-100 Series
• Cable Exit Angle: 90 °
• Color: Red
• Color, Housing: Red
• Contact Centerline Spacing: 0.100 in.
• Contact Mating Area Plating: Tin-Lead
• Contact Termination Area Plating: Tin-Lead
• Current, Rating: 5 A
• Diameter, Insulation: 0.06 "
• Flammability Rating: UL94V-2
• Length, Overall: 0.4 "
• Material, Contact: Copper Alloy
• Material, Housing: Nylon
• Number Of Positions: 4
• Pin Spacing: 0.1 "
• Primary Type: Interconnect System
• Special Features: Closed End
• Standards: UL 94V-2 Housing Flammability Rating
• Temperature, Operating: -55 to +105 °C
• Termination: IDC
• Voltage, Rating: 250 V
• Wire Size: 22 AWG
• Wire, Awg: 22
• Connector Design: Closed End
• Product Line: MTA-100
• Termination Method To Wire/cable: IDC Standard
• Wire Size (mm² [awg]): 0.3-0.4² [22]
• Mating Connector Lock: With
• Four Points Of Contact: Without
• Shrouded: No
• Mounting Ears: Without
• Panel Mount Retention: Without
• Voltage Rating (vac): 250
• Solder Tail Contact Plating: Tin-Lead
• Centerline (mm [in]): 2.54 [0.100]
• Narrow: No
• Post Number(s) Omitted: None
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Tin-Lead
• Contact Base Material: Copper Alloy
• Connector Style: Receptacle
• Housing Color: Red
• Mating Alignment: With
• Ul Flammability Rating: UL 94V-2
• Housing Material: Nylon
• Mating Alignment Type: Polarizing Tab
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Applies To: Wire/Cable
• Application Use: Wire-to-Board
• Packaging Method: Loose Piece

.244 [6.2]
.327 [8.3] Max.
Potting Height
.079-.142±.004
.347
[8.8]
.079-.032±.004
[2-3.6±0.1]
.337 [8.55]
.252
[6.4]
[2-0.8±0.1]
Retention Lock
Recommended PC Board Layout
[14.5]
.571
Acceptable Board Thickness
.079-.051+.004/-0
[2-1.3+0.1/-0]
Section X-X
.207 [5.3]
Urethane Coating Area
.062 [1.57]
[13.4]
.528
.327 Max.
[8.3]
.063 +.004/-0 Dia. Punched Hole
[1.60 +0.1/-0]
.065 +.004/-0 Dia. Drilled Hole
[1.65 +0.1/-0]
.158±.004 [4.0±0.1]
.315±.004 [8.0±0.1]
.169 [4.3]
.045 [1.14] Sq. Post
.146 [3.7]
.118
[3.0]
Component Mounting Side
.118 [3.0]
.150 [3.8]
.039 [1.0]
Mating Height
.224 [5.7]
Soldering Side
.732 [18.6]
.197 [5.0]
Max. Dia.
Section X-X
.154 [3.9] Max. Dia.
Eyelet
PC Board
.128 [3.25]
.189 [4.8]