103777-2 TE Connectivity, 103777-2 Datasheet - Page 244
![Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Thru-Hole](/photos/41/39/413989/pr1055048a_sml.jpg)
103777-2
Manufacturer Part Number
103777-2
Description
Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Thru-Hole
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Series
AMPMODU MOD II Seriesr
Datasheet
1.1-102618-8.pdf
(320 pages)
Specifications of 103777-2
Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
4
Gender
HDR
Contact Plating
Tin-Lead
Termination Method
Solder
Rohs Compliant
NO
Product Type
Headers - Breakaway
Number Of Positions / Contacts
4
Row Spacing
2.54 mm
Mounting Style
PCB
Mounting Angle
Vertical
Termination Style
Solder
Housing Material
Thermoplastic, Glass Filled
Contact Material
Phosphor Bronze
Current Rating
3 A
Operating Temperature Range
- 65 C to + 105 C
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
No
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Termination Post Length (mm [in])
2.29 [0.090]
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Breakaway
Number Of Positions
4
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Tin-Lead
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C
Approved Standards
UL E28476, CSA LR7189
Operating Temperature (°c)
-65 – +105
High Temperature Housing
No
High Speed Serial Data Connector
No
Lead Free Status / Rohs Status
No
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5
244
.025 [0.64] Square
Straight Post (With or
Without Swaged Tail)
Material and Finish
Housing — Black thermoplastic,
94V-0 rated
Posts — Brass, plated as follows:
Plating A — Duplex plated .000030
[0.00076] gold on contact area, .000100
[0.00254] min. tin on solder area, with
entire post underplated .000050
[0.00127] nickel
Plating B — Duplex plated .000015
[0.00038] gold on contact area, .000100
[0.00254] min. tin on solder area, with
entire post underplated .000050
[0.00127] nickel
Plating C — .000100 [0.00254] tin
over .000050 [0.00127] nickel on entire
post
Related Product Data
Mateable AMPMODU MTE
Products —
Receptacle Assemblies
(Polarized/Latching) —
pages 230, 231
Receptacle Assemblies with Guide
Ribs (installed in Single-Row
Coupling Shroud) —
pages 232, 233, 235, 240
Technical Documents
pages 277, 278
Product Specification
108-25034
Application Specification
114-25026
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
—
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
[3.05]
AMPMODU Interconnection System
MTE Headers, Shrouded Polarized/Latching,
Single-Row .100 [2.54] Centerline
.120
[1.52]
.060
[1.52]
.060
Note: Swaged retention tails are provided in a minimum of two locations per header.
*±.003 [±0.08]; tolerances not to accumulate within one connector pattern.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
[2.54]
.100
Typ.
A
B
C
X
X
Recommended PC Board Hole Layout
[0.89±0.08]
[1.02±0.08]
(for Retention Tails)
.035±.003
.040±.003
[2.54]
.100*
Position No. 1 Indicator
or
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Dia. Typ.
Dia. Typ.
Typ.
[13.59]
C
.535
[2.54]
.100
[5.08]
.200
[6.98]
.275
[5.84]
.230
Swaged Retention Tail
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
(See Note)
Section X-X
[8.89]
.350
(Contact Area)
[5.08]
.200
Ref.
[3.30]
.130
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