146130-7 TE Connectivity, 146130-7 Datasheet - Page 43
![Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST SMD](/photos/41/39/413996/pr1055015a_sml.jpg)
146130-7
Manufacturer Part Number
146130-7
Description
Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Series
AMPMODU MOD II Seriesr
Datasheet
1.1-102618-8.pdf
(320 pages)
Specifications of 146130-7
Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
16
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Rohs Compliant
NO
Product Type
Headers - Breakaway
Number Of Positions / Contacts
16
Row Spacing
2.54 mm
Mounting Style
SMD/SMT
Mounting Angle
Vertical
Termination Style
Solder
Housing Material
Thermoplastic, Glass Filled
Contact Material
Phosphor Bronze
Current Rating
3 A
Operating Temperature Range
- 65 C to + 125 C
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
Yes
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Breakaway Header
Yes
Pcb Mounting Orientation
Vertical
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Breakaway
Number Of Positions
16
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (30)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Approved Standards
UL E28476, CSA LR7189
High Temperature Housing
Yes
Temperature Range (°c)
-65 – +125
High Temperature Compatible
Yes
High Speed Serial Data Connector
No
Lead Free Status / Rohs Status
No
- Current page: 43 of 320
- Download datasheet (17Mb)
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
■
■
■
■
■
■
■
■
Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
43
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