146140-9 TE Connectivity, 146140-9 Datasheet - Page 141

• Manufacturer Part Number: 146140-9
• Description: Conn Socket Strip RCP 20 POS 2.54mm Solder RA Thru-Hole Gang of Tubes
• Manufacturer: TE Connectivity
• Type: Socket Stripr
• Series: Mod II Seriesr

Specifications of 146140-9

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 20
• Gender: RCP
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Product Type: Receptacles / Sockets - PCB
• Number Of Positions / Contacts: 20
• Mounting Style: Through Hole - Solder
• Mounting Angle: Right
• Termination Style: Solder Pin
• Housing Material: Polyester Polycyclohexylenedimethylene Terephthalate (PCT)
• Contact Material: Phosphor Bronze
• Current Rating: 2 A
• Operating Temperature Range: - 55 C to + 125 C
• Connector Series: Mod II
• Profile: Standard
• Mounting Pattern (mm [in]): 2.54 x 7.87 [.100 x .310]
• Sealed: No
• Holddown Feature: Without
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Retention: Without
• Termination Method To Pc Board: Through Hole - Solder
• Closed Entry: With
• Board Standoff: With
• Stackable: Yes
• Contact - Rated Current (a): 2
• Contact Resistance (m?): 12
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 2.92 [0.115]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Connector Height (mm [in]): 6.05 [0.238]
• Number Of Positions: 20
• Centerline, Matrix (mm [in]): 2.54 x 2.54 [.100 x .100]
• Contact Plating, Mating Area, Material: Gold (10)
• Contact Base Material: Phosphor Bronze
• Contact Configuration: Short Point
• Housing Entry Style: Side
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Government/industry Qualification: No
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -55 – +125
• High Temperature Compatible: Yes
• Packaging Method: Gang of Tubes
• Lead Free Status / Rohs Status: No RoHS Version Available

Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Parallel PC board stacking
without use of mother boards
Provides space between
boards for interference-free
routing of wire-to-board
connections
Two header heights
available: .785 [19.94] and
1.200 [30.48]
Vertical mount headers are
fully shrouded
Receptacle contacts have
dual cantilever beams with
built-in overstress protection
.025 [0.64] sq. posts and
receptacle contacts on
double-row, .100 x .100
[2.54 x 2.54] centers
Header posts and receptacle
contacts are phosphor
bronze, duplex plated
Housings are made of
flame retardant, glass-filled
thermoplastic
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
AMPMODU Stacking Connectors—Shrouded,
.025 x .025 [0.64 x 0.64] Posts
AMPMODU stacking
connectors are a two-piece
interconnection system
designed for parallel
stacking printed circuit
boards, without the use of
mother boards.
Vertical mount headers and
receptacle assemblies
feature duplex plated posts
and receptacle contacts on
a double-row, .100 x .100
[2.54 x 2.54] grid. The .025
[ 0.64] sq. header posts are
more protected, and the
top-entry receptacle
contacts utilize the proven
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
AMPMODU receptacle
contact design; dual
cantilever beams with built-
in overstress protection.
Headers are available in
two heights: .785 [19.94]
and 1.200 [30.48]. This
allows the customer to
use the height of the header
to keep wire-to-board
connections up and
away from other board
components, particularly if
the components are densely
packaged around the
header.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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