5-146258-3 TE Connectivity, 5-146258-3 Datasheet - Page 38

• Manufacturer Part Number: 5-146258-3
• Description: Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU MOD II Seriesr

Specifications of 5-146258-3

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 6
• Gender: HDR
• Contact Plating: Tin Over Nickel
• Termination Method: Solder
• Product Type: Headers - Breakaway
• Contact Gender: Pin (Male)
• Number Of Positions / Contacts: 6
• Row Spacing: 2.54 mm
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Latching Type: Unlatched
• Termination Style: Solder Pin
• Housing Material: Thermoplastic, Glass Filled
• Contact Material: Phosphor Bronze
• Voltage Rating: 750 V
• Current Rating: 3 A
• Mount Angle: Vertical
• Pcb Mount Retention: Without
• Surface Mount Compatible: Yes
• Board Standoff: With
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Current Rating (a): 3
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 2.29 [0.090]
• Solder Tail Contact Plating: Tin over Nickel, Matte Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 6
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Tin
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Approved Standards: UL E28476
• High Temperature Housing: Yes
• High Speed Serial Data Connector: No
• Lead Free Status / Rohs Status: Details

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38
Material and Finish
Housing — Glass-filled thermoplastic,
black, 94V-0 rated
Contacts — Copper alloy; duplex
plated .000030 [0.00076] gold in
mating area, .000150 [0.00381] tin
on solder posts, with entire contact
underplated .000050 [0.00127] nickel
Related Product Data
Performance Specifications —
page 63
Mateable Connectors — pages 27,
28, 32, & 33
Board-to-Board Spacing — page 63
PC Board Hole Layout — page 41
Technical Documents —
Product Specification 108-1093
Application Specification
114-25031
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Single Row, Vertical
page 64
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Thru-Hole Receptacles, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
Note: All part numbers are RoHS compliant.
No. of
Pos.
10
12
15
20
30
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
(Continued)
Circuit Identification
Feature
1.044 [26.52]
1.544 [39.22]
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Dimension
.544 [13.82]
.644 [16.35]
.794 [20.17]
A
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
5-104192-2
5-104192-3
5-104192-4
5-104192-5
5-104192-7
Numbers
Part