5111595-6 TE Connectivity, 5111595-6 Datasheet - Page 19
![Conn IDC Connector M 26 POS 2.54mm IDT RA Cable Mount](/photos/41/49/414903/pr5111595_sml.jpg)
5111595-6
Manufacturer Part Number
5111595-6
Description
Conn IDC Connector M 26 POS 2.54mm IDT RA Cable Mount
Manufacturer
TE Connectivity
Type
IDC Connectorr
Datasheet
1.104069-4.pdf
(60 pages)
Specifications of 5111595-6
Pitch
2.54 mm
Number Of Rows
4
Number Of Contacts
26
Gender
M
Contact Plating
Tin-Lead Over Nickel
Termination Method
IDT
Rohs Compliant
YES
Type Of Connector
Paddleboard
Connector Type
Connector Assembly
Mating Connector Lock
Without
Wire/cable Type
Ribbon Cable
Mount Angle
Vertical
Pcb Mount Retention
Without
Cover Material
Polyester
Voltage (vac)
30
Insulation Resistance (m?)
5,000
Contact - Rated Current (a)
0.5
Termination Post Length (mm [in])
2.54 [0.100]
Number Of Positions
26
Ribbon Cable Centerline Spacing (mm [in])
0.64 [0.025]
Contact Termination Type
Through Hole
Contact Base Material
Copper Alloy
Contact Plating, Mating Area, Material
Tin
Housing Material
Liquid Crystal Polymer (LCP)
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Rohs/elv Compliance History
Always was RoHS compliant
Applies To
Printed Circuit Board
Temperature Range (°c)
-65 – +105
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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