6-146130-2 TE Connectivity, 6-146130-2 Datasheet - Page 57
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6-146130-2
Manufacturer Part Number
6-146130-2
Description
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Datasheet
1.5-87589-1.pdf
(96 pages)
Specifications of 6-146130-2
Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
26
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Product Type
Connector
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
Yes
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Breakaway Header
Yes
Pcb Mounting Orientation
Vertical
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Solder Tail Contact Plating
Matte Tin over Nickel
Header Type
Breakaway
Number Of Positions
26
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (30)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Housing Material
Thermoplastic - GF
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Approved Standards
UL E28476, CSA LR7189
High Temperature Housing
Yes
Temperature Range (°c)
-65 – +125
High Temperature Compatible
Yes
High Speed Serial Data Connector
No
Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Parallel PC board stacking
without use of mother boards
Provides space between
boards for interference-free
routing of wire-to-board
connections
Two header heights
available: .785 [19.94] and
1.200 [30.48]
Vertical mount headers are
fully shrouded
Receptacle contacts have
dual cantilever beams with
built-in overstress protection
.025 [0.64] sq. posts and
receptacle contacts on
double-row, .100 x .100
[2.54 x 2.54] centers
Header posts and receptacle
contacts are phosphor
bronze, duplex plated
Housings are made of
flame retardant, glass-filled
thermoplastic
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
AMPMODU Stacking Connectors—Shrouded,
.025 x .025 [0.64 x 0.64] Posts
AMPMODU stacking
connectors are a two-piece
interconnection system
designed for parallel
stacking printed circuit
boards, without the use of
mother boards.
Vertical mount headers and
receptacle assemblies
feature duplex plated posts
and receptacle contacts on
a double-row, .100 x .100
[2.54 x 2.54] grid. The .025
[ 0.64] sq. header posts are
more protected, and the
top-entry receptacle
contacts utilize the proven
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
AMPMODU receptacle
contact design; dual
cantilever beams with built-
in overstress protection.
Headers are available in
two heights: .785 [19.94]
and 1.200 [30.48]. This
allows the customer to
use the height of the header
to keep wire-to-board
connections up and
away from other board
components, particularly if
the components are densely
packaged around the
header.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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