HCP0704-4R7-R Cooper/Bussmann, HCP0704-4R7-R Datasheet
HCP0704-4R7-R
Specifications of HCP0704-4R7-R
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HCP0704-4R7-R Summary of contents
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... HCP0704-2R3-R 2.30 HCP0704-3R3-R 3.30 HCP0704-4R7-R 4.70 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms , I sat rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise recommended the part temperature not exceed 155° ...
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... Inductance value in μ Decimal point “R” is present, then last character zeros Part Marking: HCP0704 Packaging Information - mm 1.5 Dia min. Section A-A 7.50 HCP0704-R40 to 1R0= 4.2 HCP0704-1R8 to 4R7= 4.0 Supplied in tape-and-reel packaging, 1000 parts per reel, 13” diameter reel. Temperature Rise vs. Total Loss ...
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Core Loss 001 10 Inductance Characteristics 100% 80% 60% 40% 20 20% 0209 BU-SB09086 Core Los p-p 100 B (G aus ...
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Solder Reflow Profile T P Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C Preheat A T smax T smin t s 25°C Time 25°C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak ...