P1173.223T PULSE ELECTRONICS CORPORATION, P1173.223T Datasheet - Page 2
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P1173.223T
Manufacturer Part Number
P1173.223T
Description
Power Inductors 22uH 20% 3.8A
Manufacturer
PULSE ELECTRONICS CORPORATION
Datasheet
1.P1171.474NLT.pdf
(2 pages)
Specifications of P1173.223T
Inductance
22 uH
Tolerance
20 %
Maximum Dc Current
3.8 Amps
Maximum Dc Resistance
42 mOhms
Dimensions
12.24 mm W x 12.24 mm L x 8 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
1. Unless otherwise specified, all testing is made at
2. Optional Tape & Reel packaging can be ordered by
3. The "NL" suffix indicates an RoHS-compliant part
4. Temperature of the component (ambient plus
5. The rated current (Irated) as listed is either the satura-
6. The saturation current, Isat, is the current at which
7. The heating current, Idc, is the DC current required
Take note that the component's temperature rise varies depending on the system condition. It is suggested that the
component be tested at the system level, to verify the temperature rise of the component during system operation.
www.pulseeng.com
Notes from Tables (pages 27 - 42)
SMT POWER INDUCTORS
Shielded Drum Core Series
USA 858 674 8100
PG0085/86
PG0087
PG0040/41
P1174
PF0601
PF0464
PF0465
P1166
P1167
PF0560NL
P1168/69
P1170/71
P1172/73
PF0552NL
PF0553NL
100kHz, 0.1VAC.
adding a "T" suffix to the part number (i.e. P1166.102NL
becomes P1166.102NLT). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
number. Non-NL suffixed parts are not necessarily
RoHS compliant, but are electrically and mechanically
equivalent to NL versions. If a part number does not
have the "NL" suffix, but an RoHS compliant version is
required, please contact Pulse for availability.
temperature rise) must be within specified operating
temperature range.
tion current or the heating current depending on which
value is lower.
the component inductance drops by the indicated
percentage (typical) at an ambient temperature of
25°C. This current is determined by placing the
component in the specified ambient environment and
applying a short duration pulse current (to eliminate
self-heating effects) to the component.
to raise the component temperature by the indicated
delta (approximately). The heating current is
determined by mounting the component on a
typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple
on top of the unit under test.
Part No.
• •
Trise Factor
Germany 49 7032 7806 0
(K0 )
2.3
5.8
0.8
0.8
4.6
3.6
3.6
1.9
2.1
5.5
4.8
4.3
5.6
8.3
7.1
Core Loss Factor
5.29E-10
15.2E-10
2.80E-10
6.47E-10
14.0E-10
24.7E-10
33.4E-10
29.6E-10
42.2E-10
136E-10
184E-10
201E-10
411E-10
201E-10
411E-10
(K1)
• •
Singapore 65 6287 8998
• •
43
Shanghai
8. In high volt*time (Et) or ripple current applications, addi-
Estimated Temperature Rise:
Trise = [Total loss (mW) / K0]
Total loss = Copper loss + Core loss (mW)
Copper loss = I
Irms = [I
Core loss = K1 x f (kHz)
Bac (peak to peak flux density) = K2 x ΔI (Ga)
K2 is a core size and winding dependant value and
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
is given for each p/n in the proceeding datasheets.
K0 & K1 are platform and material dependant constants
and are given in the table below for each platform.
tional heating in the component can occur due to core
losses in the inductor which may necessitate derating
the current in order to limit the temperature rise of the
component. In order to determine the approximate total
loss (or temperature rise) for a given application, both
copper losses and core losses should be taken into
account.
86 21 54643211 / 2
D
DC
2
+ ΔI
D
D
RMS
2
/12]
• •
China 86 755 33966678
2
1/2
x DCR (Typical) (mW)
[= K2/L(µH) x Et(V-µSec) (Ga)]
(A)
1.23
x Bac(Ga)
.833
(
o
C )
• •
2.38
SPM2007 (11/07)
Taiwan 886 3 4641811
(mW)