4951G Aavid Thermalloy, 4951G Datasheet

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4951G

Manufacturer Part Number
4951G
Description
THERMAL EPOXY
Manufacturer
Aavid Thermalloy
Series
Thermalbond™r
Type
Hardener Epoxyr
Datasheet
1.4951G.pdf (5 pages)

Specifications of 4951G

Size / Dimension
3.5 oz Package
Chemical Component
Epoxy Resin/N-Butyl Glycidyl Ether (Epoxy)/Amine Compound/Amine Curing Agent/Bisphenol A/Polyoxypropylenedia Mine/Piperazine/Triethanolamine (Hardener)
Primary Type
Adhesive
Special Features
High Strength
Temperature, Rating
-65 to +155 °C
Time, Setting
30 min.
Weight
3.5 Oz.
Product
Thermal Management
Adhesive Type
Epoxy
Adhesive Applications
Bonding - Thermal Heat Sink
Dispensing Method
Single Use Package
Operating Temperature Max
155°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
33869

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
4951G
Manufacturer:
ATH
Quantity:
49
Thermal
Adhesives
Ther-O-Bond 1500
Epoxy casting system for potting and encapsulation
Ther-O-Bond 1600
Two part epoxy for bonding
Ther-O-Bond 2000
Rapid cure acrylic adhesive
Thermalbond™
High strength epoxy adhesive
Adhesives offer excellent heat transfer and high voltage isolation.
Epoxy adhesives offer low shrinkage, and coefficients of thermal
expansion comparable to copper or aluminum. They bond readily to
metals, glass, ceramics, and most plastics.
Ther-O-Bond 1500
Ther-O-Bond 1500 is a versatile epoxy casting system developed for
high performance, production potting and encapsulating applications
where low shrinkage and rapid air evacuation are required. This
formulation has a very low surface tension and a flowable viscosity,
which affords excellent air release. Ther-O-Bond 1500 adhers to rigid
plastics and laminates, metals and ceramics, has a low coefficient of
thermal expansion and is readily machined and shaped with ordinary
shop tools. The fully cured epoxy system is an excellent electrical
insulator which provides good resistance to electrolysis, leakage and
corrosion room water, weather, gases and chemical compounds.
Ordering Information
Handling Characteristics
Products
Description Part Number
Ther-O-
Bond 1500
Mix Ratio by Weight,
Resin to Hardener:
Mixed Viscosity @ 25°C, cps: 1000 - 1500
Work-Life @ 25°C
Gel Time @ 25°C
Cure Schedule @ 25°C
Cure Schedule @ 65°C
Cure Schedule @ 100°C
/
Interface Materials
159900F00000G
100 to 15
45 Minutes
3-6 Hours
8 Hours
1 Hour
0.5 Hour
/
RoHS
Adhesives
PCN
Package/
Kit
Resin
and
Hardener
Size
.946
liter
(1
Qt.)

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4951G Summary of contents

Page 1

Products Interface Materials Adhesives / / Thermal Adhesives Ther-O-Bond 1500 Epoxy casting system for potting and encapsulation Ther-O-Bond 1600 Two part epoxy for bonding Ther-O-Bond 2000 Rapid cure acrylic adhesive Thermalbond™ High strength epoxy adhesive Adhesives offer excellent heat transfer ...

Page 2

... Enter the area of the device that will contact the heat sink: Enter the grease thickness: Interface Resistance = Formula Part No. RoHS PCN 4949G 4950G Part Discontinued 4951G 4952G 4953G Note: Matched quantity of RT-7 hardener is included. • © MSDS Safety Net Weight Sheets 25 grams Hardener ( ...

Page 3

... CHEMICAL PRODUCT AND COMPANY IDENTIFICATION Product name: Product Use/Class: Reference: Also sold as Circalok 6037 Green Manufactured for AAVID THERMALLOY, LLC 2. COMPOSITION/INFORMATION ON INGREDIENTS Chemical Name CAS Number Epoxy resin PROPRIETARY N-Butyl glycidyl ether 2426-08-6 N.A. - Not Applicable, N.E. - Not Established Skin Designation 3 ...

Page 4

Product: THERMALBOND 4952 A, FIRST AID - INHALATION: Move person to fresh air. Restore and support continued breathing. If breathing is difficult, give oxygen. Get immediate medical attention. FIRST AID - INGESTION: If swallowed, do not induce vomiting. Give victim ...

Page 5

Product: THERMALBOND 4952 A, 9. PHYSICAL AND CHEMICAL PROPERTIES ODOR: APPEARANCE: PHYSICAL STATE: ODOR THRESHOLD: SOLUBILITY IN H2O: pH: FREEZE POINT: COEFFICIENT OF WATER/OIL DISTRIBUTION: (See section 16 for abbreviation legend) 10. STABILITY AND REACTIVITY CONDITIONS TO AVOID: High temperatures. ...

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