HS01 Cirrus Logic Inc, HS01 Datasheet

HEATSINK TOP MT TO-3

HS01

Manufacturer Part Number

HS01

Description

HEATSINK TOP MT TO-3

Manufacturer

Cirrus Logic Inc

Series

Apex Precision Power™r

Datasheet

1.HS01.pdf (1 pages)

Specifications of HS01

Package Cooled

TO-3

Attachment Method

Bolt On

Outline

40.64mm x 25.40mm

Height

1.000" (25.40mm)

Product

Heatsinks

Heatsink Material

Aluminum

Dimensions

38.1 mm L x 25.4 mm W x 25.4 mm H

Designed For

PWM Amplifiers

Color

Black

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

-

Thermal Resistance @ Forced Air Flow

-

Thermal Resistance @ Natural

-

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

598-1367

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

HS011-10125

Manufacturer:

SAMSUNG

Quantity:

4 803

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

HS011-20105

Quantity:

1 122

Company:

Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

Part Number:

HS01G

Manufacturer:

ON/安森美

Quantity:

20 000

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