270-AB Wakefield Thermal Solutions, 270-AB Datasheet

HEATSINK TO-220 SM FOOTPRINT BLK

270-AB

Manufacturer Part Number
270-AB
Description
HEATSINK TO-220 SM FOOTPRINT BLK
Manufacturer
Wakefield Thermal Solutions
Series
270r
Datasheets
1.274-2AB.pdf (20 pages)
2.274-1AB.pdf (23 pages)

Specifications of 270-AB

Thermal Resistance
6 C / W
Height
0.375" (9.53mm)
Color
Black
Package Cooled
TO-220, TO-202
Attachment Method
Bolt On
Outline
44.45mm x 17.78mm
Power Dissipation @ Temperature Rise
4W @ 70°C
Thermal Resistance @ Forced Air Flow
6.0°C/W @ 400 LFM
Thermal Resistance @ Natural
17.5°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
28.45 mm L x 11.05 mm W x 19.05 mm H
Designed For
TO-220, TO-202
Packages Cooled
TO-202 / TO-220
Width
17.8mm
Heat Sink Material
Aluminum
Length
44.5mm
Mounting Type
Screw
Size
1.75L X 0.375H X 0.530W"
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1041

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
270-AB
Manufacturer:
WAK
Quantity:
5 169
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Standard
P/N
217-36CTE6
217-36CTTE6
217-36CTRE6
Material: Copper, Matte Tin Plated
22
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
6/14/07
217-36CT6
Height Above
.360 (9.1)
.360 (9.1)
.360 (9.1)
PC Board
in. (mm)
10:54 AM
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Dimensions
Page 22
Footprint
in. (mm)
217 HEAT SINK WITH
DDPAK DEVICE
REEL DETAILS
SECTION A-A
KEY:
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
í
Tape & Reel
Package
Device only, NC
Format
Bulk
Tube
Surface Mount Heat Sinks
v
Device + HS, NC
Package
Quantity
250
20
1
Device Power Dissipation. W
125°C LEAD, 40°C AMBIENT
TAPE DETAILS
THERMAL PERFORMANCE
6 LAYER BOARD, D ' PAK
Device + HS, 100 lfm
Convection
55°C @ 1W
55°C @ 1W
55°C @ 1W
Natural
Thermal Performance at Typical Load
„
Device + HS, 200 lfm
Dimensions: in.
D
2
PAK, TO-220, SOT-223, SOL-20
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Convection)
Device + HS, 300 lfm
Forced

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270-AB Summary of contents

Page 1

WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm) 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) 217-36CTTE6 .360 (9.1) .600 ...

Page 2

WTS001_p1-25 6/14/07 10:54 AM Page 23 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES MECHANICAL DIMENSIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESD Material with Nail Stops 20 Pieces per Tube 217-36CTT6 Dimensions: ...

Page 3

WTS001_p1-25 6/14/07 10:54 AM Page 24 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink 206 SERIES Standard P/N 206-1PABEH Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 230 & 234 SERIES Height Above Standard PC Board ...

Page 4

WTS001_p1-25 6/14/07 10:54 AM Page 25 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 241 SERIES Standard P/N 241-69ABE-03 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 262 SERIES Standard P/N 262-75ABE-05 262-75ABE-01 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Horizontal Mount Heat Sink Height ...

Page 5

WTS001_p26-49 6/14/07 10:55 AM Page 26 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 & 236 SERIES Height Above Standard PC Board P/N in. (mm) 233-60AB .600 (15.2) 233-60ABE-01 .600 (15.2) 233-60ABE-05 .500 (12.7) 233-60ABE-10 .725 (18.4) ...

Page 6

... Labor-Saving Clip-On Heat Sinks Footprint PC Board Dimensions Mounting in. (mm) in. (mm) Configuration 1.000 (25.4) .800 (20.3) x .270 (6.9) Vert./Horiz. .800 (20.3) .800 (20.3) x .270 (6.9) Verl./Horiz. SECTION A-A Dimensions: in. (mm) Snap-Down Self-Locking Heat Sinks Footprint PC Board Dimensions Mounting in. (mm) in. (mm) Configuration ...

Page 7

WTS001_p26-49 6/14/07 10:55 AM Page 28 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink 265 SERIES Standard P/N 265-118ABHE-22 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 286DB SERIES Standard P/N 286DBE Material: Aluminum, Black Anodized ...

Page 8

WTS001_p26-49 6/14/07 10:55 AM Page 29 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Height Above Standard P/N 273-AB 273-ABE-01 273-ABE-02 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 273-AB 274 & 281 SERIES Height Above Standard P/N 274-1AB 274-1ABE-01 274-1ABE-02 274-2AB ...

Page 9

WTS001_p26-49 6/14/07 10:55 AM Page 30 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Height, Low-Profile Twisted Fin Heat Sinks 242 SERIES Height Above Standard PC Board P/N in. (mm) 242-125ABE-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 ...

Page 10

WTS001_p26-49 6/14/07 10:55 AM Page 31 BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 244 SERIES Standard P/N 244-145AB 244-145ABE-50 1.650 (41.9) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 245 SERIES Standard P/N 245-145AB 245-145ABE-50 1.650 (41.9) ...

Page 11

WTS001_p26-49 6/14/07 10:55 AM Page 32 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks 247 SERIES Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 ...

Page 12

... MECHANICAL DIMENSIONS Dimensions: in. (mm) 271 SERIES Standard P/N 271-AB Material: Aluminum, Black Anodized This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. MECHANICAL DIMENSIONS Dimensions: in. (mm) Compact Wave-Solderable Low-Cost Heat Sinks Height Above Maximum ...

Page 13

... The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02). ...

Page 14

WTS001_p26-49 6/14/07 10:55 AM Page 35 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES Standard P/N 250-122AB 250-122ABE-09 250-122ABE-25 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 250-122AB Dimensions: in. (mm) 237 & 252 SERIES Standard P/N 237-167AB2 237-167AB3 237-167ABE2-24 1.675 (42.5) ...

Page 15

WTS001_p26-49 6/14/07 10:55 AM Page 36 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks 286 SERIES See also 286DB Series on Page 7. Height Above Standard PC Board P/N in. (mm) ...

Page 16

WTS001_p26-49 6/14/07 10:55 AM Page 37 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 695 SERIES Standard P/N 695-1B Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with ...

Page 17

WTS001_p26-49 6/14/07 10:56 AM Page 38 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Epoxy Insulated For TO-5 260 SERIES 260-4T5E Thermal Links for Fused Glass Diodes 258 SERIES Standard P/N 258 0.500 (12.7) x 0.250 (6.4) x ...

Page 18

WTS001_p26-49 6/14/07 10:56 AM Page 39 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Standard Plain Pin 634-10ABEP 634-15ABEP 634-20ABEP Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti- cally mounting ...

Page 19

WTS001_p26-49 6/14/07 10:56 AM Page 40 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting 667 SERIES Standard P/N Standoff Pin Plain Pin 667-10ABESP 667-10ABPP 667-15ABESP 667-15ABPP 667-20ABESP 667-20ABPP 667-25ABESP 667-25ABPP ...

Page 20

WTS001_p26-49 6/14/07 10:56 AM Page 41 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 647 SERIES Standard P/N 647-1OABEP 647-15ABEP 647-175ABEP 647-20ABEP 647-25ABEP Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit ...

Page 21

WTS001_p26-49 6/14/07 10:56 AM Page 42 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS High-Performance Notched Heat Sinks for Vertical Board Mounting 657 SERIES Standard P/N 657-10ABEPN 657-15ABEPN 657-20ABEPN 657-25ABEPN Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS ...

Page 22

WTS001_p26-49 6/14/07 10:56 AM Page 43 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES Standard P/N 690-3B 690-66B 690-220B Material: Aluminum, Black Anodized These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available ...

Page 23

... Mounting Height Hole Dia. in. (mm) in. (mm) 0.562 (14.3) 0.200 (5.1) 52°C @ 5.0W 0.562 (14.3) 0.270 (6.9) 52°C @ 5.0W 0.562 (14.3) None 52°C @ 5.0W 0.562 (14.3) None 41°C @ 5.0W dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary ...

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