217-36CTE6 Wakefield Thermal Solutions, 217-36CTE6 Datasheet - Page 6

• Manufacturer Part Number: 217-36CTE6
• Description: HEATSINK DPAK SMT TIN PLATED
• Manufacturer: Wakefield Thermal Solutions
• Series: 217r

Specifications of 217-36CTE6

• Height: 0.360" (9.14mm)
• Package Cooled: D²Pak
• Attachment Method: SMD Pad
• Outline: 18.80mm x 15.20mm
• Power Dissipation @ Temperature Rise: 1W @ 55°C
• Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 55°C/W
• Packages Cooled: SOL-20 / SOT-223 / TO-220
• Thermal Resistance: 16°C/W
• Width: 18.8mm
• Heat Sink Material: Copper
• Length: 15.2mm
• Size: 0.390H X 0.600W X 0.740D"
• Mounting Type: PC Board Surface Mount
• Product: Heatsinks
• Heatsink Material: Copper
• Dimensions: 21.34 mm L x 21.34 mm W x 11.93 mm H
• Designed For: D2Pak, TO-220, SOT-223, SOL-20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 139-808351-002; 217-36CTE6; 345-1099; Q2679969

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
PATENT PENDING
PATENT 5381041
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
6/14/07
239-75AB
10:55 AM
Standard
P/N
235-85AB
235-85ABE-01
235-85ABE-05
235-85ABE-10
Material: Aluminum, Black Anodized
Standard
P/N
243-1PAB
243-3PAB
Material: Aluminum, Pre-anodized Black
Standard
P/N
239-75AB
239-75ABE-03
239-75ABE-04
Material: Aluminum, Black Anodized
235 SERIES
243 SERIES
239 SERIES
235-85AB-05
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243 SERIES
Height Above
Height Above
Height Above
Dimensions: in. (mm)
1.000 (25.4)
.850 (21.6)
.850 (21.6)
.500 (12.7)
.975 (24.8)
.750 (19.1)
.750 (19.1)
.750 (19.1)
.800 (20.3)
PC Board
PC Board
PC Board
in. (mm)
in. (mm)
in. (mm)
235-85AB
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Snap-Down Self-Locking Heat Sinks
Labor-Saving Clip-On Heat Sinks
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
.850 (21.6) x 1.000 (25.4)
MECHANICAL DIMENSIONS
.800 (20.3) x .270 (6.9)
.800 (20.3) x .270 (6.9)
SECTION A-A
Dimensions
Dimensions
Dimensions
Dimensions: in. (mm)
Footprint
Footprint
Footprint
in. (mm)
in. (mm)
in. (mm)
235-85AB-01
Configuration
Configuration
Configuration
SECTION A-A
Vert./Horiz.
Vert./Horiz.
Verl./Horiz.
239-75AB-03
Vert./Horiz
239-75AB-04
Mounting
Horizontal
Mounting
Mounting
239 SERIES
Vertical
Vertical
Vertical
Vertical
235-85AB-10
235 SERIES
Tab Options
Tab Options
Tab Options
Solderable
Solderable
Solderable
No Tab
No Tab
No Tab
No Tab
01
05
10
03
04
VIEW B-B
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
Mounting
Mounting
Style
Style
Style
Clip
Clip
Convection
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
Convection
Convection
38°C @ 2W
38°C @ 2W
38°C @ 2W
Thermal Performance at Typical Load
Thermal Performance at Typical Load
50°C@ 2W
78°C@ 2W
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
Natural
Natural
Natural
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
4.5°C/W @ 400 LFM
8.2°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
Board Level
Heat Sinks
Convection
Convection
Convection
Forced
Forced
Forced
TO-220
TO-220
TO-220
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