217-36CTE6 Wakefield Thermal Solutions, 217-36CTE6 Datasheet - Page 19

• Manufacturer Part Number: 217-36CTE6
• Description: HEATSINK DPAK SMT TIN PLATED
• Manufacturer: Wakefield Thermal Solutions
• Series: 217r

Specifications of 217-36CTE6

• Height: 0.360" (9.14mm)
• Package Cooled: D²Pak
• Attachment Method: SMD Pad
• Outline: 18.80mm x 15.20mm
• Power Dissipation @ Temperature Rise: 1W @ 55°C
• Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 55°C/W
• Packages Cooled: SOL-20 / SOT-223 / TO-220
• Thermal Resistance: 16°C/W
• Width: 18.8mm
• Heat Sink Material: Copper
• Length: 15.2mm
• Size: 0.390H X 0.600W X 0.740D"
• Mounting Type: PC Board Surface Mount
• Product: Heatsinks
• Heatsink Material: Copper
• Dimensions: 21.34 mm L x 21.34 mm W x 11.93 mm H
• Designed For: D2Pak, TO-220, SOT-223, SOL-20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 139-808351-002; 217-36CTE6; 345-1099; Q2679969

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are
available in three standard types to mount and cool one TO-3 or TO-66 metal power semicon-
ductor type or two plastic package TO-220 power semiconductor types. For higher power
Achieve optimum natural convection cooling per unit volume occupied above the printed
c i rcuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style
cases, when this low-cost heat sink is used. Any mounting attitude will provide free circ u l a t i o n
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS
690 SERIES
Standard
690-3B
690-66B
690-220B
Material: Aluminum, Black Anodized
P/N
680-5A
680-75A
680-10A
680-125A
680-75220
680-10220
680-125220
Material: Aluminum, Black Anodized
P/N
680 SERIES
Standard
680-5220
690 SERIES
HIghest Efficiency/Lowest Unit Cost Heat Sinks
Maximum Efficiency Omnidirectional Heat Sinks
PC Board “A”
1.310 (33.3)
1.310 (33.3)
1.310 (33.3)
0.500 (12.7)
0.750 (19.1)
1.000 (25.4)
1.250 (31.8)
0.500 (12.7)
0.750 (19.1)
1.000 (25.4)
1.250 (31.8)
Height Above
Height Above
PC Board
in. (mm)
in. (mm)
TO-3
A
TO-3
Footprint Dimensions
Horizontal Mounting
Outline Dimensions
1.860 (47.2)-sq
1.860 (47.2)-sq
1.860 (47.2)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
in. (mm)
in. (mm)
SEMICONDUCTOR MOUNTING HOLES
SEMICONDUCTOR MOUNTING HOLES
680 SERIES
*TWO TO-220’S
48
220
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting
surface temperature rise above ambient air temperature of no more than 91°C.
of air in natural convection applications. These 680 Series heat sinks can also be specified with-
out any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
TO-66
Thermal Performance at Typical Load
Thermal Performance at Typical Load
7O°C @ 7.5W
44°C @ 7.5W
44°C @ 7.5W
44°C @ 7.5W
70°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
Convection
Convection
Natural
Natural
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
1.5°C/W @ 400 LFM
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
2.0°C/W @ 400 LFM
*TWO TO-220’S
Convection
Convection
Forced
Forced
CONVECTION CHARACTERISTICS
K
NATURAL AND FORCED
Semiconductor
Semiconductor
CONVECTION CHARACTERISTICS
Hole Pattern
Hole Pattern
(2) TO-220
(2) TO-220
(2) TO-220
(2) TO-220
(2) TO-220
Mounting
(1) TO-66
Mounting
(1) TO-3
(1) TO-3
(1) TO-3
(1) TO-3
(1) TO-3
NATURAL AND FORCED
TO-3, TO-66, TO-220
TO-3, TO-220
0.0700 (31.75)
0.0700 (31.75)
0.0700 (31.75)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
Normally stocked
lbs. (grams)
lbs. (grams)
Weight
Weight