658-25AB Wakefield Thermal Solutions, 658-25AB Datasheet - Page 17

• Manufacturer Part Number: 658-25AB
• Description: HEATSINK CPU 28MM SQ BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-25AB

• Height: 0.250" (6.35mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 2W @ 40°C
• Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 6.35 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Heat Sink Material: Aluminum
• Length: 27.9mm
• Mounting Type: Adhesive
• Size: 0.250H X 1.100W X 1.100L"
• Package / Case: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1036

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
8
7
6
5
4
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
500
500
500
600
600
600
700
700
700
3
2
1
0
3
2
1
0
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
100
100
7
6
5
4
3
2
1
0
100
200
200
200
200
200
200
300
300
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
AIR VELOCITY (LFM)
618-100AB
400
400
400
400
400
618-20AB
400
500
500
500
500
500
500
600
600
600
600
600
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700
700
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700