658-60AB Wakefield Thermal Solutions, 658-60AB Datasheet - Page 9

• Manufacturer Part Number: 658-60AB
• Description: HEATSINK CPU 28MM SQ BLK W/OTAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-60AB

• Height: 0.600" (15.20mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 2.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 15.24 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Heat Sink Material: Aluminum
• Length: 27.9mm
• Mounting Type: Adhesive
• Size: 0.600H X 1.100W X 1.100L"
• Package / Case: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1072

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500