657-15ABP Wakefield Thermal Solutions, 657-15ABP Datasheet - Page 2

• Manufacturer Part Number: 657-15ABP
• Description: HEATSINK TO-220 W/PINS BLK 1.5"
• Manufacturer: Wakefield Thermal Solutions
• Series: 657r

Specifications of 657-15ABP

• Thermal Resistance: 3.3 C / W
• Height: 1.500" (38.1mm)
• Color: Black
• Package Cooled: TO-220
• Attachment Method: Bolt On and PC Pin
• Outline: 41.91mm x 25.40mm
• Power Dissipation @ Temperature Rise: 6W @ 38°C
• Thermal Resistance @ Forced Air Flow: 3.3°C/W @ 200 LFM
• Thermal Resistance @ Natural: 6.3°C/W
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 25.4 mm L x 41.9 mm W x 38.1 mm H
• Designed For: TO-220, TO-247, TO-218
• Packages Cooled: TO-218 / TO-220 / TO-247
• Width: 41.9mm
• Heat Sink Material: Aluminum
• Length: 25.4mm
• Mounting Type: PC Board Through Hole
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: 345-1033

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
MECHANICAL DIMENSIONS
PATENT PENDING
MECHANICAL DIMENSIONS
Dimensions: in.
Dimensions: in. (mm)
Normally stocked
217 SERIES
234 SERIES
TUBE: 16.25 Inches Long,
20 Pieces per Tube
Min. ESDMaterial with Nail
Stops
TUBE DETAILS
234-75AB
217-36CTT6
Surface Mount Heat Sinks
230 AND 234 SERIES
Standard
P/N
230-75AB
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
234-75AB-01
234-75AB-05
Material: Aluminum, Black Anodized
230-75AB-01
Height Above
.750 (19.1)
.500 (12.7)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
PC Board
in. (mm)
234-75AB-01
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
230-75AB-10
BOARD LAYOUT RECOMMENDATIONS
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Dimensions
in. (mm)
Footprint
230 AND 234 SERIES
234-75AB-05
31
Configuation
Vert./Horiz.
Vert./Horiz
Horizontal
Mounting
Horizontal
Vertical
Vertical
Vertical
SOL 20
Solderable
All other products, please contact factory for price, delivery, and minimums.
230-75AB-05
No Tab
No Tab
Option
234 SERIES
Tab
01
05
10
01
05
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
Style
CONVECTION CHARACTERISTICS
Thermal Performance at Typical Load
NATURAL AND FORCED
Convection
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
Natural
230 SERIES
217-36CT6
D
2
PAK, TO-220, SOL-20
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
Board Level
Heat Sinks
Convection)
Forced
TO-220