658-25ABT3 Wakefield Thermal Solutions, 658-25ABT3 Datasheet - Page 2

• Manufacturer Part Number: 658-25ABT3
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-25ABT3

• Height: 0.250" (6.35mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 2W @ 40°C
• Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Length: 27.9mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 345-1096

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
30
25
20
15
10
5
0
20
18
16
14
12
10
8
6
4
2
0
200
200
300
Approach Velocity, LFM
300
Approach Velocity, LFM
PRODUCT FEATURES
PRODUCT FEATURES
400
400
624-25-T4
624-35-T4
624-45-T4
624-60-T4
625-25-T4
625-25-T4
625-45-T4
625-60-T4
500
500
600
600