658-60ABT1 Wakefield Thermal Solutions, 658-60ABT1 Datasheet - Page 6
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658-60ABT1
Manufacturer Part Number
658-60ABT1
Description
HEATSINK CPU 28MM SQ BLK W/TAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-60ABT1
Height
0.600" (15.20mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
2.5W @ 30°C
Thermal Resistance @ Forced Air Flow
3°C/W @ 300 LFM
Packages Cooled
BGA / LED
Width
27.9mm
Length
27.9mm
Mounting Type
Adhesive
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 15.24 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1073
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
PRODUCT FEATURES
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
I I
L
G G
I