658-35ABT4 Wakefield Thermal Solutions, 658-35ABT4 Datasheet - Page 11

HEATSINK CPU 28MM SQ BLK W/TAPE

658-35ABT4

Manufacturer Part Number
658-35ABT4
Description
HEATSINK CPU 28MM SQ BLK W/TAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet

Specifications of 658-35ABT4

Height
0.35" (9mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
2W @ 50°C
Packages Cooled
BGA / LED
Width
27.9mm
Length
27.9mm
Mounting Type
Adhesive
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 8.89 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1068
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
100
100
200
200
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
500
500
600
600
700
700
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
100
100
100
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
7
6
5
4
3
2
1
0
10
100
9
8
7
6
5
200
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
604-40AB
604-60AB
400
400
400
610-35AB
400
400
400
500
500
500
500
500
500
600
600
600
600
600
600
700
700
700
700
700
700
14
12
10
8
6
4
2
0

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