658-60ABT3 Wakefield Thermal Solutions, 658-60ABT3 Datasheet - Page 17
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658-60ABT3
Manufacturer Part Number
658-60ABT3
Description
HEATSINK CPU 28MM SQ BLK W/TAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-60ABT3
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
27.94mm x 27.94mm
Height
0.600" (15.20mm)
Power Dissipation @ Temperature Rise
2.5W @ 30°C
Thermal Resistance @ Forced Air Flow
3°C/W @ 300 LFM
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 15.24 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Color
Black
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1075
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
8
7
6
5
4
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
500
500
500
600
600
600
700
700
700
3
2
1
0
3
2
1
0
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
100
100
7
6
5
4
3
2
1
0
100
200
200
200
200
200
200
300
300
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
AIR VELOCITY (LFM)
618-100AB
400
400
400
400
400
618-20AB
400
500
500
500
500
500
500
600
600
600
600
600
600
700
700
700
700
700
700