658-60ABT4 Wakefield Thermal Solutions, 658-60ABT4 Datasheet - Page 19

• Manufacturer Part Number: 658-60ABT4
• Description: HEATSINK CPU 27.9MM SQ W/ADH BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-60ABT4

• Height: 0.600" (15.20mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 2.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Length: 27.9mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 15.24 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1094; 65860ABT4

18 x 18 PGA
17 x 17 SPGA
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