518-95AB-MS4 Wakefield Thermal Solutions, 518-95AB-MS4 Datasheet

HEATSINK DC/DC HALF BRICK VERT

518-95AB-MS4

Manufacturer Part Number
518-95AB-MS4
Description
HEATSINK DC/DC HALF BRICK VERT
Manufacturer
Wakefield Thermal Solutions
Series
518r
Datasheets
1.637-10ABP.pdf (8 pages)
2.528-24AB.pdf (7 pages)
3.518-95AB-MS4.pdf (3 pages)

Specifications of 518-95AB-MS4

Thermal Resistance
2.2 C / W
Height
0.95" (24.13mm)
Color
Black
Package Cooled
Half Brick DC/DC Converter
Attachment Method
Bolt On
Outline
61.00mm x 57.90mm
Power Dissipation @ Temperature Rise
11W @ 60°C
Thermal Resistance @ Forced Air Flow
2.0°C/W @ 300 LFM
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Unidirectional Fin
Dimensions
61 mm L x 57.9 mm W x 24.1 mm H
Designed For
DC/DC Converters
Packages Cooled
Half Brick
Width
57.9mm
Heat Sink Material
Aluminum
Length
61mm
Mounting Type
Screw
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1056
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case
power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find
a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)
All other products, please contact factory for price, delivery, and minimums.
tion with an optimized heat sink surface area. The 641K type with an open channel area of
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
Extruded
Heat Sinks
MECHANICAL
DIMENSIONS
MECHANICAL
DIMENSIONS
MECHANICAL
DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
301 SERIES
621 AND 623 SERIES
Standard
P/N
621A
621K
623A
623K
301/302/303 SERIES
Standard
P/N
301K
301M
301N
302M
302MM
302N
302NN
303M
303MM
303N
303NN
641 SERIES
Standard
P/N
641A
641K
(EXTRUSION PROFILE 1371)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
641 SERIES
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 3.000 (76.2)
4.750 (120.6) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Dimensions
in. (mm)
Outline
SERIES
Dimensions
301
302
303
Footprint
Dimensions
in. (mm)
in. (mm)
Outline
302 AND 303 SERIES
Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
0.750 (19.1)
0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth
0.750 (19.1) (1)
1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (1)
1.500 (38.1) (2)
3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (1)
3.000 (76.2) (2)
Length “A”
in. (mm)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
1.000 (25.4)
1.000 (25.4)
in. (mm)
Height
in. (mm)
Height
1
1
1
1
⁄
1
SEMICONDUCTOR MOUNTING HOLES
⁄
⁄
⁄
⁄
K
4
4
4
4
4
SEMICONDUCTOR MOUNTING HOLES
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
50
Pattern and Number
A
in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the
standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and
“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black
Anodized.
Hole Pattern
SEMICONDUCTOR MOUNTING HOLES
Mounting
(1) TO-3
(1) TO-3
Mounting
Hole (s)
None
None
None
Mounting
(1) TO-3
Pattern
A
None
Hole
M
K
75°C @ 15W
75°C @ 15W
52°C @ 15W
52°C @ 15W
Convection
Thermal Performance at Typical Load
Natural
36°C @ 15W
36°C @ 15W
K
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
5O°C @ 15W
N
70°C @ 15W
70° C @ 15W
70° C @ 15W
50° C @ 15W
50°C @ 15W
50°C @ 15W
37° C @ 15W
37° C @ 15W
37° C @ 15W
37° C @ 15W
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
2.0°C/W @ 250 LFM
2.0°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
2.5° C/W @ 250 LFM
2.5° C/W @ 250 LFM
2.5° C/W @ 250 LFM
1.8° C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8° C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
Convection
Forced
Convection
Convection
Forced
Forced
0.2900 (131.54)
0.2900 (131.54)
Normally stocked
STUD-MOUNT
0.1000 (45.36)
0.2100 (95.26)
0.210O (95.26)
lbs. (grams)
0.1000 (45.36)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (60.33)
0.1330 (60.33)
lbs. (grams)
0.1330 (6033)
lbs. (grams)
Weight
TO-3
Weight
TO-3
Weight

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518-95AB-MS4 Summary of contents

Page 1

Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621 AND 623 SERIES Footprint Standard Dimensions P/N in. (mm) 621A 4.750 (120.6) x 1.500 (38.1) 621K 4.750 (120.6) x 1.500 (38.1) 623A 4.750 (120.6) x 3.000 (76.2) 623K 4.750 (120.6) ...

Page 2

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 401 AND 403 SERIES Standard Width P/N in. (mm) 401A 4.750 (120.7) 401F 4.750 (120.7) 401K 4.750 (120.7) 403A 4.750 (120.7) 403F 4.750 (120.7) 403K 4.750 (120.7) With fins oriented vertically in cabinet sidewall ...

Page 3

Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 431 AND 433 SERIES Standard Width P/N in. (mm) 431K 4.750 (120.7) 433K 4.750 (120.7) Need maximum heat dissipation from a TO-3 rectifier heat sink in minimum space? The Wakefield 431 ...

Page 4

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 465 AND 476 SERIES Nominal Dimensions Standard Width P/N in. (mm) 465K 4.000 (101.6) 476K 5.000 (127.0) 476W 5.000 (127.0) Wakefield Engineering has designed four standard heat sink types for ease of installation and ...

Page 5

Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 490 SERIES King Size Heat Sinks for High-Power Rectifiers Standard Width P/N in. (mm) 490-35K 9.250 (235.0) 490-6K 9.250 (235.0) 490-12K 9.250 (235.0) The 490 Series can be used to mount ...

Page 6

... EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS SERIES 517, 527, 518 AND 528 Footprint Standard Dimensions P/N in. (mm) 517-95AB 2.28 (57.9) x 2.40 (61.0) 527-45AB 2.28 (57.9) x 2.40 (61.0) 527-24AB 2.28 (57.9) x 2.40 (61.0) 518-95AB 2.40 (61.0) x 2.28 (57.9) 528-45AB 2.40 (61.0) x 2.28 (57.9) 528-24AB 2 ...

Page 7

Extruded Heat Sinks HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTs, RELAYS 510, 511 AND 512 SERIES Standard Catalog P/N (5) Milled Nonmilled Base (1) Base (2) 510-3M 510-3U 510-6M 510-6U 510-9M 510-9U 510-12M 510-12U 510-14M 510-14U 511-3M 511-3U ...

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