609-50ABS3 Wakefield Thermal Solutions, 609-50ABS3 Datasheet - Page 4

• Manufacturer Part Number: 609-50ABS3
• Description: HEATSINK FOR POWERPC CPU BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 609r

Specifications of 609-50ABS3

• Height: 0.500" (12.70mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Clip
• Outline: 73.53mm x 50.80mm
• Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Unidirectional Fin
• Dimensions: 73.5 mm L x 50.8 mm W x 12.7 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Packages Cooled: BGA
• Width: 50.8mm
• Mounting Type: Clip-On
• Length: 73.5mm
• Package / Case: BGA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1058

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
PRODUCT FEATURES
14
12
10
8
6
4
2
0
Performance shown is with T4 thermal adhesive applied.
200
300
Approach Velocity, LFM
400
642-25-T4
642-35-T4
642-45-T4
642-60-T4
500
600