680-125A Wakefield Thermal Solutions, 680-125A Datasheet - Page 9

HEATSINK POWER TO-3 BLK

680-125A

Manufacturer Part Number
680-125A
Description
HEATSINK POWER TO-3 BLK
Manufacturer
Wakefield Thermal Solutions
Series
680r
Datasheets

Specifications of 680-125A

Thermal Resistance
1.5 C / W
Height
1.250" (31.7mm)
Color
Black
Package Cooled
TO-3
Attachment Method
Bolt On
Outline
45.97mm x 45.97mm
Power Dissipation @ Temperature Rise
8W @ 45°C
Thermal Resistance @ Forced Air Flow
1.5°C/W @ 400 LFM
Thermal Resistance @ Natural
6°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
46 mm L x 46 mm W x 31.8 mm H
Designed For
TO-3, TO-220
Packages Cooled
TO-3 / TO-220
Width
46mm
Heat Sink Material
Aluminum
Length
46mm
Mounting Type
PC Board Through Hole
Size
1.250H X 1.810W X 1.810L"
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1051

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
680-125A
Manufacturer:
WAK
Quantity:
320
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for
improved performance.
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
288 SERIES
Standard
P/N
288-1AB
Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
electrical connections for vertical mounting of TO-220 and TO-202 semicon-
ductor packages. These heat sinks are designed for use where minimum PC
271 SERIES
Standard
P/N
271-AB
Material: Aluminum, Black Anodized
Compact Wave-Solderable Low-Cost Heat Sinks
Top-Mount Booster Heat Sinks for Use with 270/272/280 Series
Semiconductor Case
Height Above
0.500 (12.7)
in. (mm)
Height Above
1.250 (31.8)
PC Board
in. (mm)
1.750 (44.5) x 0.700 (17.8)
288 SERIES
271 SERIES
Mounting Footprint
Dimensions
Horizontal
in. (mm)
0.875 (22.2) x 0.215 (5.5)
Maximum
Footprint
in. (mm)
38
NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown
with (2) 271-AB types added to (1) 272-AB type.
31 °C @ 4W (NOTE B)
62°C @ 4W (NOTE A)
board space is available. The 288-1AB is a stamped aluminum heat sink, black
sink occupying minimum space, available at minimum cost.
anodized, designed for applications requiring good heat dissipation from a heat
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
85°C @ 4W
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
NATURAL AND FORCED
1.8°C/W 400 LFM (NOTE B)
5.1°C/W @ 400 LFM
12°C/W @ 200 LFM
Convection
Forced
Convection
Forced
TO-220, TO-202
Normally stocked
0.0057 (2.59)
0.0052 (2.36)
lbs. (grams)
lbs. (grams)
TO-220
Weight
Weight

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