260-4T5E Wakefield Thermal Solutions, 260-4T5E Datasheet - Page 20

• Manufacturer Part Number: 260-4T5E
• Description: HEATSINK TO-5 EPOXY INSUL BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 260r

Specifications of 260-4T5E

• Package Cooled: TO-5
• Attachment Method: Bolt On
• Outline: 9.65mm Dia
• Height: 0.37" (9.40mm)
• Thermal Resistance @ Natural: 14°C/W
• Product: Hardware & Accessories
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Thermal Resistance: 14 C / W
• Dimensions: 9.4 mm L x 9.7 mm W
• Designed For: TO-5
• Thread Size - Imperial: 4-40
• For Use With: TO-5 Package Devices
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1013

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-
conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient
Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed cir-
cuit board, where two or more TO-3s must be placed in proximity and minimum space is
Normally stocked
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
(EXTRUSION PROFILE 1284)
635 SERIES
601 SERIES
601 AND 603 SERIES
Standard
P/N
601E
601F
601K
603K
Material: Aluminum Alloy, Black Anodized
635 SERIES
Standard
P/N
635-5B2
635-75B2
635-10B2
635-125B2
Material: Aluminum Alloy, Black Anodized
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 2.000 (50.8)
Space-Saving Low-Cost Heat Sinks
PC Board “A”
Height Above
0.500 (12.7)
0.750 (19.1)
1.250 (31.8)
1.000 (25.4)
in. (mm)
Dimensions
Footprint
in. (mm)
Low-Height Heat Sinks
K
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
Dimensions
in. (mm)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
Outline
in. (mm)
SEMICONDUCTOR MOUNTING HOLES
Height
(EXTRUSION PROFILE 1284)
49
603 SERIES
heat dissipation are required. The 601 and 603 Series may also be attached to enclosure pan-
els or brackets using isolation hardware where necessary.
pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns.
available for heat sinking. Four different heights are available, all with TO-3 mounting hole
E
0.200 (5.1)
0.270 (6.9)
Mounting
Hole Dia.
in. (mm)
None
None
90°C @ 8.0W
77°C @ 8.0W
61°C @ 8.0W
53°C @ 8.0W
Thermal Performance at Typical Load
Convection
Natural
All other products, please contact factory for price, delivery, and minimums.
52°C @ 5.0W
41°C @ 5.0W
52°C @ 5.0W
52°C @ 5.0W
Thermal Performance at Typical Load
Convection
CONVECTION CHARACTERISTICS
Natural
6.0°C/W @ 300 LFM
4.8°C/W @ 300 LFM
3.6°C/W @ 300 LFM
3.1°C/W @ 300 LFM
NATURAL AND FORCED
Convection
Forced
CONVECTION CHARACTERISTICS
F
NATURAL AND FORCED
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.0°C/W @ 175 LFM
Convection
Forced
Semiconductor
Hole Pattern
Mounting
TO-3
TO-3
TO-3
T0-3
DO-4/DO-5 Diodes
Board Level
Heat Sinks
0.0500 (22.68)
0.0500 (22.68)
0.0500 (22.68)
0.0810 (36.74)
0.0200 (9.07)
0.0220 (9.98)
0.024 (10.89)
0.028 (12.70)
lbs. (grams)
lbs. (grams)
Weight
Weight
TO-3