421K Wakefield Thermal Solutions, 421K Datasheet
421K
Manufacturer Part Number
421K
Description
HEATSINK POWER NO MNT HOLES BLK
Manufacturer
Wakefield Thermal Solutions
Series
421r
Specifications of 421K
Height
2.62" (66.55mm)
Color
Black
Package Cooled
TO-3
Attachment Method
Press Fit
Outline
120.65mm x 76.20mm
Power Dissipation @ Temperature Rise
50W @ 58°C
Thermal Resistance @ Forced Air Flow
0.7°C/W @ 250 LFM
Thermal Resistance @ Natural
1.16°C/W
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Unidirectional Fin
Dimensions
76.2 mm L x 120.7 mm W x 66.7 mm H
Designed For
TO-3, DO-5, Stud Mounted Semiconductor Cases
Packages Cooled
TO-3
Thermal Resistance
58°C/W
Width
120.7mm
Heat Sink Material
Aluminum
Length
76.2mm
Mounting Type
PC Board Through Hole
Size
2.625H X 4.750W"
Package / Case
TO-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1049
421-K
421-K
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
421K-03LFT
Manufacturer:
TOSH
Quantity:
1 584
Part Number:
421K-03LFT
Manufacturer:
IDT
Quantity:
20 000
Part Number:
421K-12LFT
Manufacturer:
IDT
Quantity:
20 000
Related parts for 421K
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
HEAT SINK WITH THERMAL TAPE
Manufacturer:
Wakefield Thermal Solutions
Part Number:
Description:
SILICON GREASE 5 OZ TUBE
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
THERMAL COMPOUND SYNTHETIC 4 OZ
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
SILICON GREASE 8 OZ JAR
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK CPU 28MM SQ BLK
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK CPU 28MM SQBLK W/O TAPE
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK CPU 28MM SQBLK W/O TAPE
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK CPU 28MM SQ BLK W/OTAPE
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK 100PQFP COMPOSITE
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEAT SINK BGA/PGA 16.5X16.5X8.9
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK CPU 43MM SQ BLK H=.4"
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK CPU 28MM SQ BLK W/TAPE
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
HEATSINK CPU 28MM SQ BLK W/TAPE
Manufacturer:
Wakefield Thermal Solutions
Datasheet:
Part Number:
Description:
Heatsinks DIE# 016078 6FT BAR EXTRUSION
Manufacturer:
Wakefield Thermal Solutions
Part Number:
Description:
30CC SIZE OF 122 HEAT SINK COMPOUND
Manufacturer:
Wakefield Thermal Solutions
421K Summary of contents
Page 1
...
Page 2
...
Page 3
...
Page 4
...
Page 5
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S ...
Page 6
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...
Page 7
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...
Page 8
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...